Metcal announces array package rework system

Metcal has unveiled its APR-5000-XLS Array Package Rework System for large-to-small PCBs; claiming to set the benchmark for the precise, cost-effective rework of the widest range of component types, including BGA, CSP, Land Grid Array (LGA), micro SMD, Micro-Lead Frame (MLF) and Bumped Chip Component packages. The APR-5000-XLS is said to be capable of handling boards 24.5" x 24.5" (610mm x 610mm) in size and up to 0.25" (6.35mm) thick. The APR-5000-XLS uses a single reflow/placement head and a stationery PCB that is centered over an enhanced, dual-zone pre-heater capable of handling both large and small boards. Metcal’s heating is reported to result in uniform temperature control not only horizontally, across the surface of large and small PCBs, but also vertically, over stacked components. New to the APR-5000-XLS is Metcal’s innovative Split Vision System, which allows operators to view the opposite corners of a component with the necessary magnification to make its placement and registration fast and accurate. Source: PCBnewsline