RVSI to exhibit WS-3800 series at SEMICON Japan 2007
Nov 09, 2007
RVSI Inspection LLC, a leader in semiconductor package and bumped wafer inspection, announces that its industry-leading WS-3800 series wafer inspection system will be on display during the upcoming SEMICON Japan 2007 exhibition and conference scheduled to take place December 5-7, 2007 at the Makuhari Messe in Chiba, Japan.
WS-3800 features the ability to detect surface defects on 300 mm wafers using gold bump technology. Additionally, it offers production-speed inspection of gold bumps for nodule and crater detection. The WS-3800 offers the overall ability to find surface and bump defects on 300 mm wafers, in addition to its superior 3-D technology.
While the WS-3800 offers the highest 3-D accuracy for the inspection of the height of gold bumps, customers are also interested in the detection of nodules and craters in the surface of the gold bumps. In order for the LCD driver chips to properly adhere to the glass panels, the gold bumps must be of uniform height and free of any defects such as nodules or craters. The customized lighting developed by RVSI allows the system to capture these defects at the highest speeds and, more significantly, with minimum overkill.
RVSI's WS-3800 wafer inspection system offers the industry's best combination of production-speed, 2-D surface defect inspection and 3-D bumped wafer metrology. Depending on features, systems sell for $500,000 to more than $1 million.
Rather than traditional wire bonds, the newest generation of integrated circuits uses microscopic-sized solder or gold "bumps" that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of wafers and flip chip die, providing a method to maximize yields and profitability by inspecting wafers at high production rates. System capabilities include macro defect inspection of unbumped wafers, probe marks, pre- and post-reflow solder bumps, and multi-process gold bumps.