Global Technology Awards honour OK International's breakthrough rework system
Nov 27, 2007
The team at OK International are currently celebrating a successful performance at the Global Technology Awards where the APR-5000-DZ Advanced Package Rework System topped the hand soldering, repair and rework category.
The APR-5000-DZ Array Package Rework System features dual convection bottom-side heating for lead-free rework and high thermal demand applications. Enhancing and enabling fast ramp and tighter delta temperature control for highly targeted and controlled rework, the system is ideal for high thermal demand boards including lead-free and multi-layer assemblies up to 12" x 12" (305mm x 305mm). Building on the proven strengths of OK International's APR-5000 Series, the APR-5000-DZ was judged an important innovation for advanced package rework at the Productronica-based awards.
Paul Wood, APR specialist and Market Development Manager, and Hoa Nguyen, Director of Engineering were at the ceremony to collect the award. And, Paul Wood explained: "We are delighted to receive this important accolade, recognition of our commitment to continual innovation in the area of electronics assembly. The APR-5000-DZ system is a breakthrough development for manufacturers working with BGA and SMT rework, especially lead-free, and our Global Technology Award has sealed its status as an exciting technology for today's industry."