Bench top MultiLayer Press from LPKF
Oct 15, 2007
The LPKF MultiPress S is a microprocessor-controlled bench-top multilayer lamination press, ideal for creating multilayer circuit boards in a lab or prototyping environment. The MultiPress S is useful when speed, security, or convenience are key factors in the creation of custom or prototype printed circuit boards and is an indispensable tool in any rapid PCB prototyping situation. With a reduced pressing time of less than ninety minutes, the system offers faster turnaround times than ever before to develop production-quality multilayer prototype boards.
The MultiPress S bonds multilayer circuits of all common rigid and flexible substrates. It delivers equal pressure on the full press plate area, creating no air-pockets upon completion. With precise control of all important process parameters such as temperature, pressure and cycle times, the LPKF MultiPress S produces durable lamination. Nine different heating/pressing/cooling process profiles can be programmed into the system, with a maximum press area of 9" x 12" and temperature up to 482 °F (250 °C) the system can bond even RF-multilayer substrates. A powerful heating unit and efficient heat transmission for short cool-down phases reduce process times to a minimum.
When combined with a ProtoMat circuit board plotter and a through-hole conductivity solution, the MultiPress S provides the final key to producing complex multilayered printed circuit board prototypes - perfect for today's extreme time-to-market needs. The MultiPress S is delivered with an automatic hydraulic press mechanism, which provides constant and reliable pressure control through the entire lamination process.
More information is available at LPKF's website: www.lpkfusa.com