Henkel prepares for grand opening of Henkel Huawei Electronics Mold Compound Facility
Oct 19, 2007
Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, today announced plans to unveil its new state-of-the-art mold compound manufacturing facility in Lianyungang, China on October 26, 2007.
Henkel Huawei Electronics' continued growth has necessitated additional manufacturing lines to support its global customer base. The new operation will encompass 16,000 square meters of administrative and manufacturing space and have a total production capacity of 25,000 tons of material annually.
With production of more than ten patented epoxy mold compound formulations, Henkel Huawei's Lianyungag site will not only be the central manufacturing hub, but will also deliver R&D capabilities for new product development, material prototype production, test and analysis and ongoing future technologies research. Henkel Huawei mold compound materials are currently incorporated into a variety of devices, from mainstream to leading-edge, including: discrete components, SOICs, QFPs, BGAs, CSPs and POPs. The company supports numerous semiconductor firms globally, a customer list that includes the world's top packaging companies.
"This opening is the successful culmination of a very intense period of planning, capabilities streamlining and product advancement," states Patrick Trippel, president of the electronics group of Henkel. "The result of our careful attention to detail and significant resource investment can be seen in the ongoing success of our customers. We have pledged to deliver the most advanced, process-enabling electronics materials and unyielding local customer support to our customers around the globe and we continue to deliver on that promise. The expansion of Henkel Huawei Electronics Co. Ltd. is yet another example of this commitment."
"This event will undoubtedly be one of the most memorable milestones in our company's history," concludes Trippel, "but certainly not the last."