Productronica 2007 - exhibitor preview I

It is less than two week before tens of thousands of electronics manufacturing industry professionals descend on Munich to see the latest and greatest products. 


Here are a few exhibitor highlights. Another preview will run early next week and if you would like your company included send details of your exhibit to editors@emsnow.com  

ACE Production Technologies - Hall A2, Stand 105

ACE Production Technologies Inc., a manufacturer of selective soldering systems for electronics assembly, will be exhibiting selective soldering systems with internal (integral) Pre-heating modules for the first time at industry shows this fall, including ATE, IPC Midwest, SMTAI, and Productronica. These systems were announced in July 2007 but have not yet made their debut at industry trade shows.

ACE's internal preheat capability is designed for large, high-mass assemblies which are a challenge for selective soldering, where process heat is applied only to the bottom side of the assembly. The ability to apply continuous, real-time top-side pre-heating during the selective soldering process is critical to achieving good soldering results when processing such assemblies.

The new preheating capability promotes the draw of the solder through the barrel to the top side of the board, enhancing the formation of solder fillets on the top side. The implementation of internal continuous pre-heat, during the selective soldering process, improves thermal distribution and solderability of difficult assemblies. All of the show machines will also include Dual Flux heads - one Spray and one Drop-jet, a new flexible feature added earlier this year.

For more information about A.C.E., visit www.ace-protech.com.


Alfautomazione SpA - Hall A1, Stand 439

Alfautomazione SpA will present the following functional test solutions:

The ECUTest is a High-Performance Automated Functional Tester for the new generation of Automotive Electronic Control Units as Engine Control Units,Body Controllers, Automatic Gearbox Controllers, ABS Controllers and more.

This unique system implements a comprehensive test setup with unsurpassed signal integrity and parallel test technologies for either Parametric or Dynamic Testing (run-mode). The tester implements high speed test technology based upon industrial standards like PXI and NI TestStand and the latest Virtual Instrumentation to provide a highly scalable and time proof solution.

The multitask signal matrix allows up to 200 measurement channels on a single DUT. System implements a Power (10A) and Hi-power (32A) switch matrices for high-flexibility interfacing up to 48 switched dummy loads, a High Voltage static source (up to +/-500V), AWG sources (up to +/-100V) and 16 High Voltage Probes.

The DashTest C In-Line is the newest and most competitive solution for today's demand of volume production cluster test applications. By means of embedded test electronic design and vision tools, the system offers almost equivalent performances of the high end system of the DashTest serie by Alfautomazione, at the same time reducing key figures like fixture e application setup complexity, footprint and overall costs.

Main application areas are automotive instrument clusters and dashboard inspection. With side applications area of control panel, front panel and screen inspection.

The system offers ergonomic design with optimized footprint, no application dependent camera set-up, built-in self-test and ready-to-go software tools for Product Diversity Management on the production floor.

DMBTest and Compact Multi-Media Test (CMMT)
Multimedia Series including automated functional testers for the new generation of multimedia and broadcasting products, such as flat screen and digital TV, set top boxes, home entertainment.

DMBTest implements high-speed test technology based on commercially available technology such as PXI and NI TestStand as well as the latest virtual instrumentation generation to provide highly scalable and time-efficient solutions. The system implements unsurpassed signal integrity and parallel-loaded board test technologies based on Audio/Video Matrix Architecture.


AlternativeSMT - Hall A5, Stand 480

AlternativeSMT has added some interesting new options to the FeederMaster system and will be demonstrating them at this year's show.

The new developments concern upgraded software and a totally enclosed camera. The software now allows the user full control, including programmable zoom facility, and so has made the calibration routine more repeatable and accurate.

Some electronic feeders, for example the Siemens triple 8mm feeders, need to have each lane independently calibrated. The new software allows each lane to be calibrated at a selectable speed so that the initial calibration can be carried out at a speed that suits the operator and the complete feeder can still be tested at full speed later. This facility becomes increasingly important when smaller components are placed, such as 0402 and 0201 passive case sizes. Users still have the facility to ensure that all feeders calibrated on the machine will run in a production environment.

An optional variable LED Light Ring is also available for customers working in low light conditions.

The FeederMaster®, which is now being sold worldwide, is one of the premier tools used in feeder calibration.


Aqueous Technologies - Hall A4, stand 434

Aqueous Technologies Corp. will introduce the Trident, its fourth-generation automatic defluxing system. The Trident Series represents the next generation of lead-free compatible, fully automatic post-reflow defluxing systems.

Michael Konrad, Aqueous Technologies' president and CEO, said, "Trident represents a culmination of more than 20 years of batch-format defluxing equipment experience."

Trident automatic defluxing system is reportedly the fastest batch-format defluxing system available. Trident's specific throughput rate is determined by board size. The system is capable of defluxing and cleanliness testing up to 200 4 x 6" (101 x 152 mm) boards and up to 28 18 x 20" (457 x 508 mm) boards per hour.

Konrad states, "Trident is the most flexible defluxing system available today." The system offers several defluxing configurations designed to provide complete compatibility with all defluxing requirements. Trident's defluxing process consists of up to five cycles including prewash, wash, rinse, cleanliness testing and drying. Prewash, if selected, may consist of a steam soak, high-pressure DI water spray, or chemical spray and soak. The wash cycle uses environmentally responsible defluxing solutions, neutralizing and solublizing flux and other residues. The rinse cycle is controlled by the built-in cleanliness tester in which rinse cycles are added or subtracted from the process automatically, based on the user's selected cleanliness requirements. The dry cycle uses a unique combination of radiant and convection heat for rapid, thorough drying.

Trident is equipped with an automatic chemical management system that automatically measures and doses concentrated defluxing chemicals into the wash-solution recirculation system. The wash solution is captured and reused, eliminating routine chemical discharge. Level gauges indicate the available levels of wash solution and concentrated chemical.

Trident is equipped with a unique inverse-mounted vertically oriented spray pump that virtually eliminates pump-caused dragout, lowering the volume of defluxing chemistry consumption and associated costs. Built-in statistical process control (SPC) data capturing technology allows users to view historical SPC data, including actual cleanliness results, both at the machine and remotely from other network-connected PCs.

Trident's stainless steel plumbing and EPDM pump seals provide full compatibility with a variety of environmentally responsible, operator-safe defluxing chemicals.


Balver Zinn - Hall A3, Stand 478

Solder and anode specialist Balver Zinn of Balve, Germany and sponsors of the "Process Advice and Defect Clinic" at Productronica, announce they will showcase their range of solder paste, solder fluxes and related products.

Among the products being demonstrated is Balver Zinn's SN100C™ solder range. Developed specifically for the lead-free process of mass soldering, SN100C™ operates under process conditions similar to those of conventional lead containing alloys. With SN100C™ it is possible to achieve high productivity whilst still producing reliable joints cost-effectively. SN100C™ is outperforming competitive products in Europe, with increasing numbers of leading manufacturers incorporating it into their process and Balver Zinn is soon to announce the availability of this product as a paste for SMT. Balver Zinn has held the license for Nihon Superior's SN100C™ range of solder in Europe for five years and this year received Nihon Superior's highest accolade 'Gold Award' in recognition of outstanding sales performance of this product.

Productronica 2007 will be the first global platform for Balver Zinn to demonstrate the added strength of the company's product family following the merger with The Cobar Group BV. Cobar became part of Balver Zinn in September and Cobar, in conjunction with the Balver Zinn team, will lead the company's future development of advanced assembly materials. "Our merger with Cobar strengthens our product range by adding world-class solder paste, solder fluxes and other products," explains Mr. Josef Jost, Managing Director of Balver Zinn. "Eli Westerlaken and I welcome visitors to our stand at Productronica and look forward to meeting Balver Zinn and Cobar customers old and new."


BPM - Hall A4, Stand 380

BPM will showcase its Flashstream Flash Vector Programming System on distributor PB-Technik's stand.

Flashstream offers the fastest flash programming of NAND and NOR flash memory at speeds as low as 2.5 percent over theoretical programming minimum. This industry leading speed is due to the creation of a proprietary co-processor technology developed by BPM called Vector Engine. This technology uses a proprietary co-processor design to hardware accelerate flash memory waveforms during the programming cycle. Faster speeds are achieved through synchronous operations that eliminate the dead times when the DUT waits on the programmer. The result is programming near the theoretical limits of the silicon design - the faster the device, the faster the device is programmed.

Designed for high-density flash, the Flashstream programs NAND and NOR Flash up to 32 Gb (gigabit) and has upgradeable RAM for future densities. It comes standard with 4191 Mb (32.7 Gb) memory per site that is upgradeable to handle future densities and communicates with USB 2.0 between the host PC and programmer. The programmer also includes bad block replacement scheme for NAND and low voltage support. A four-socket manual system, Flashstream is BPM's first dedicated hardware design for flash memories, which results in a radical improvement in speed when compared to competitive flash programmers.

As an additional benefit, multiple Flashstream units can be connected to one computer to run the same programming job in concurrent programming™ mode. Single units can be mechanically connected. Also, a LED display identifies the programmer number that corresponds to software instructions.

The Flashstream's significant speed reduces labor costs as well as the number of machines needed to perform the same function.


Cobar - Hall A1, Booth 439

Cobar is issuing its SAC3 "Cobar Challenge" at Productronica with the introduction of its new SAC-XM5S SAC3 Low Voiding Lead-Free Solder Paste.

Eli Westerlaken, Managing Director of Cobar, said, "Please make no mistake: Non-voiding solder joints do not exist. Voiding is an integral part of the behavior of molten metal during solidification. With our special flux formulation, however, we can control the size of the voids to keep them within acceptable limits. We challenge any other manufacturer of solder pastes to match the performance of this new product."

Cobar's new SAC-XM5S lead-free solder paste is a dedicated low-voiding product. At the same time, it offers superior reflow and printing properties. The new paste will be on display in A4.478 at Productronica 2007.


CyberOptics - Hall A4, Stand 262

CyberOptics Corporation will highlight its Flex Ultra High-Resolution automated optical inspection system (AOI) with GPS Technologies.

Flex Ultra HR is the high-resolution, high-speed next generation of the Flex AOI platform and provides enhanced features including new 5.0 megapixel camera technology. The system offers users a 40 percent improvement in imaging resolution over the Flex Ultra, allowing inspection of 01005 components.

Flex Ultra is the award winning enhanced resolution AOI system with inspection performance for 0201 components and larger. As one of the highest-speed inspection systems in the industry, Flex Ultra is ideal for assembly lines producing automotive, memory, and notebook PCBs.

Base features of the system include high-speed pre- and post-reflow inspection capabilities, simple, programming, patented SAM™ vision technology that learns as the process varies, lowest false-call rates in the industry, and the ability to inspect any component or feature such as chips, ICs, lead-free solder joints, gold fingers, connectors, clips and screws.

CyberOptics also will exhibit its easy-to-use operator user interface (OUI) for the Flex Ultra HR. The new OUI for inspection and defect review provides operators a simpler, more intuitive graphical user interface and a common look and feel with the user interface on the CyberOptics SE 300 solder paste inspection machine. It is offered in multiple languages, including English, Chinese and Korean, and is capable of being translated into any language.


Digitaltest - Hall A1, Stand 365

Digitaltest GmbH will demonstrate its full range of hardware and software incorporated into a comprehensive selection of test solutions for electronics manufacturers.

Highlights of the show will be amongst others the company's innovative Condor Flying Probe, Lambda tester, MTS30 FCT solution and its software offerings - all with new features.

Digitaltest will showcase its second generation Flying Prober Condor 500, the latest addition to its suite of electronic test solutions. The new development shows a shuttle concept with easy front board loading. Using unique drive technology and linear motors to give high speed and high accuracy in fine-pitch applications, the Condor 500 is 30% faster than previous models. Integrated boundary-scan is an option on this platform.

Throughputs can now be doubled on Digitaltest's Lambda concept, which enables two test heads to work in parallel. The system has been designed by Digitaltest to address the key features demanded of modern manufacturing test - flexibility, high fault coverage and easy programming. The MTS 300 Lambda flexibility is guaranteed by its comprehensive range of test methods combined with a modular design that allows its optimal configuration for current needs without compromising the possibilities of future expansion. The system is also one of the fastest machines on the market - its capacity for 1,000 measurements/sec making it ideal for high volume applications.


Essemtec - Hall A5, Stand 277

Essemtec AG will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing.

CDS-PFV (Piezo Flow Valve) has been developed for "filled" liquids. The special valve sealing technique allows the dispensing of media with weak materials such as solder paste. CDS-PFV provides fast and accurate metering of solder paste or conductive adhesive, is recommended for pasty liquids, small dot metering and continuous line dispensing, and provides integrated valve heating.

CDS-PFV is a sliding valve with piezoelectric actuators. It is possible to influence the metering mass as well as the drop diameter by means of pressure, temperature, opening time and needle diameter. Undercuts causing gas bubbles and, thus, improper meterings can be reduced due to the special connecting geometry. Precision metering needles are available within an inner diameter range of 0.1 to 1.37 mm. The ceramic tight fit plates can be disassembled for cleaning purposes.

Due to the maintenance-free and extremely fast piezoelectric drive, it is possible to achieve meterings with a frequency up to 10 Hz. The minimum metering time of 2 ms allows smallest metering quantities up to approximately 10 nl (depending on the medium). Because of the incremental width of 10 μs, it is possible to effect a very exact setting of the metering quantity.

Due to the arrangement of the robust piezoelectric actuators and the exchangeable sealing parts, the lifetime of the drive and the valve seal is high. Maintenance and control of the valve seal is recommended after 3,000,000 metering cycles (depending on the medium).

CDS6700 with PFV solves numerous issues, including solder paste dispensing instead of printing, dispensing of liquids filled with ductile particles (such as solder paste or silver-filled glue), dispensing of solder paste dots as small as 100 µm (4 mil), prototype dispensing instead of printing in SMT assembly and versatile use of the dispensing system for other applications with short changeover times. The system is targeted to startup SMT manufacturers with small series, flex circuit electronics manufacturers (e.g., sensors), membrane keyboard manufacturers and the general assembly industry.

CDS6700 with PFV is an affordable solution designed for entry-level companies doing SMD prototyping.


Europlacer - Hall A4, Stand 125

Europlacer will feature the Flexys-10 intelligent placement system.

Combining all around capability with outstanding value for money, the Flexys-10 is perfect for low- to medium-volume high-mix production. Rated at a significant 10,000 cph and placing 0201s to the largest QFPs on the market, the system incorporates a high level of flexibility rarely found in low-cost solutions. Additionally, the system offers users eight new turret positions, over the previous generation's four turret positions.

The improved eight-position rotary head with on-the-fly vision helps to maintain high throughput even for boards with a wide range of components. With a feeder capacity of 128 x 8 mm tapes, the machine uses Europlacer's innovative intelligent feeder technology, simplifying changeover and maximizing productivity.

The flexible placement system features numerous key benefits including a significant protection of investment, intelligent feeder technology, "smart" nozzles and more. Most significantly, the price of this new system is the same as its predecessor, the Flexys-8. This provides the industry with a very affordable and flexible entry-level system.

Offering users a speed of 10,000 cph (IPC: 8,600 cph) and component range of 0201 to 50 x 50 mm standard (70 x 70 mm as an option), Flexys-10 has an accuracy of 35 µm for QFPs and 60 µm for chips at 3 Sigma. Additionally, the system features a minimum pitch of 0.4 mm and a tape size range of 8 to 88 mm. The system can accommodate tape, stick or tray feeder types.


EVS International - Hall A3, stand 544

The EVS 1000 is a smaller, lighter version of the popular EVS 3000/6000, with all of the recovery performance of the standard and lead-free solder units. The smaller size and footprint help reduce the cost, but still provide a capacity of 10lb/5kg of dross, giving a rapid payback and impressive return on capital employed.

The EVS 1000 can quickly convert waste dross into pure solder in minutes not hours, while improving the wave solder machine process. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders.

The EVS 1000 is aimed at small to medium users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. This group currently comprises the majority of users in the industry. By using the EVS, nitrogen can be dramatically reduced or eliminated, resulting in significant cost savings.


FINETECH - Hall A3, Stand 375

FINETECH will present a new solution for contactless board temperature measurement - the infrared start sensor.

Compared to conventional temperature measurement directly at the PBC, the new infrared start sensor offers several benefits: no in-process handling is needed during the process due to contactless infrared measurement and a laser pointer helps in finding the best measuring spot.

The infrared start sensor is characterised by an outstanding profile reliability of +/- 5 °C and allows for increased peak temperature accuracy. The PCB is only exposed to as much heat as is necessary to reduce thermal stress significantly.

Of course, existing placer control boxes can also be retrofitted with the infrared start sensor.


Gen3 Systems - Hall A3, Stand 370

Gen3 Systems Limited has announced the launch of its brand new, CE-approved CM60 floor standing ionic contamination cleanliness tester that joins the company's existing CM11 and CM12 table top testers used for smaller boards and components.

The CM60 is suitable for use as both an off-line (e.g. PCB goods-in) cleanliness process monitoring tool as well as a continuous 'in-line' sample-based statistical process control (SPC) instrument used at the beginning of a production process or after wave soldering to detect unacceptable process drifts before they manifest as a major defect issue. It also features a novel volumetric testing cell that removes the need for users to have to calculate the surface area of assemblies under test (hence reducing test setup and cycle time) and can accommodate test pieces up to 600 x 550 x 60mm in size.

Because the CM60 is intended for factory floor operation, the machine is designed to be simple for a non-skilled operator to use. As such the only manual task required is to insert the test PCB or piece at the beginning of the test and remove it at the end. Once the tester is configured, all other test cycle operations are fully automated.

Test results are presented in a graphical format and can be used for further statistical analysis. The degree of contamination directly correlates to the likelihood of a board successfully soldering, or whether an assembly has been soldered at less-than-optimum process parameters.

"In an age where adherence to legislation, stringent process control, high throughput of quality products and low consumer tolerance of failures are conflicting pressures on manufacturing engineers, the Contaminometer is one reliable tool that can make the job easier," summarises Naisbitt.


GOEPEL electronic - Hall A1 Stand 454

GOEPEL electronic will exhibit not only new products but extraordinary solutions at Productronica. At the German Company's stand, a production line will be exhibited in which various electric and optical test solutions will be integrated to demonstrate GOEPEL electronic's philosophy of "Get The Total Coverage".

A number of innovations from the Automated Optical Inspection team will be exhibited. Based on the recently introduced Extended Colour Technology(TM) GOEPEL electronic's OptiCon AOI systems offer the ability to read colour codes on components using an intelligent identification algorithm.

Just like an OCR function, the detected value is available for further evaluation.
A new axis system consisting of linear direct drive will be introduced in the Company's in-line AOI system OptiCon AdvancedLine. Additionally new materials with lower mass yet more ideal damping characteristics have been used in the construction of the system.

Further developments and new solutions of the JTAG/Boundary Scan hardware platform SCANFLEX® show that GOEPEL electronic's Boundary Scan solutions are unrivalled in terms of flexibility, modularity and performance. In particular, the revolutionary innovation VarioCore™, a technology for the flexible configuration of I/O modules, will change the Boundary Scan world decisively. In addition, a new series of complete integration modules for ICT will be introduced. Of course the best hardware can only be supported by high performance software and this is demonstrated by the newest version of the Integrated Development Environment SYSTEM CASCON™.

GOEPEL electronic will also present extensive solutions for functional test and Automotive Test. An extraordinary highlight will be the new tester generation based on USB providing cost-effective high performance customized functional test systems for ECUs without a loss in functional capability or modularity. Furthermore, the Company will exhibit, among others, their new Diagnostic concept based on the hardware module smartCAR, a combination of electrical and optical test and inspection systems, the extended CAR Master Line product family for CAN, LIN and diagnostic, as well as a multitude of test solutions for the automotive industry. Completely new PXI, PCI and USB can be found at GOEPEL electronic's stand A1 454.


High Tech Conversions - Hall A4, Stand 420

High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing will showcase its new Aquavator™ Stencil Wiping Fabric.

The Aquavator™ Stencil Wiping Fabric is set to revolutionize the industry, offering a new development within the science of automatic stencil cleaning and providing numerous benefits over existing technology. The Aquavator™ is the perfect solution for the working environment; all the operator needs to do is 'Add Water' - this eliminates the need for hazardous chemicals that are both detrimental to the air around the workplace and potentially flammable; all that is required is simple tap water.

The Aquavator™ is the only stencil wiping fabric that is truly ESD, eliminating the static build up caused by traditional fabrics that sit alongside valuable circuit boards. It exploits harmless cleaning agents which are embedded through ESD fibers to aggressively clean the stencil. The cleaning agent is activated by the water that cuts through solder paste with ease. This breakthrough in stencil cleaning technology is not only safer for the working environment, but also safer for the stencil. And the benefits don't stop there, by eliminating harmful chemicals there are no more concerns of spills, high costs in toxic chemicals, explosions, VOC issues, transportation difficulties and just as important - no shelf life worries.


HumiSeal - Hall A3, Stand 548

HumiSeal will announce the global launch of its revolutionary new 1H20 AR3 water-based conformal coating solution at Productronica 2007. HumiSeal will also celebrate 50 years of supplying quality conformal coating solutions to the global market. Further important announcements are expected during the show.

Visitors to the stand at this years show will see a brand new stand design fitting for a company that this year celebrates its 50th year of developing, manufacturing and supplying conformal coating products for the global electronics industry. This in itself is a success story, which Phil Kinner, European Sales and Technical Manager for HumiSeal Europe puts down to the company's ability to listen:

"Over the years, we have listened to what our customer base wanted and applied this to our R&D programme. I firmly believe that this approach has played a significant part in our success over the last 50 years. We are now in the position of being the only vendor able to offer the industry's widest range of conformal coating chemistries, and its broadest range of Military and UL-certified products".

At the show it will be adding to that range with the global launch of its revolutionary new water-based conformal coating product, 1H20 AR3. Developed from scratch over the past three years, this is a high-performance, high solids, fast drying, water-based acrylic that is especially suited to high volume, in-line dip coating applications. Its excellent electrical properties are directly comparable with solvent-based acrylics, while its adhesion properties and resistance to chemicals and solvents are far superior. What is more, it can protect electronics assemblies at temperature extremes far beyond the capabilities of existing resin-based alternatives.


Indium Corporation - Hall A4, Stand 163

Indium Corporation's Indium5.1AT Pb-Free Solder Paste is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;
-- Low Voiding at Via-In-Pad
-- Excellent Printability
-- Excellent Wetting
-- Robust Reflow Profile Window

Via-in-pad technology for BGA components has reduced PCB real estate requirements, but this can also lead to significantly increased voiding. Indium5.1AT delivers voiding in the 5% range over many different profiles when soldering BGAs with via-in-pad technology. Longer soak-type reflow profiles can help reduce via-in-pad voiding, but that can contribute to poor wetting, solder balling, and shorts. Indium5.1AT offers a very robust processing window that can minimize these potential defects as well as accommodate various board sizes, board densities, and throughput requirements.

Manufacturers need a solder paste that delivers consistent print volume on every circuit board, regardless of downtime or other interruptions. As CSP technology is becoming more mainstream, PCB assemblers are challenged with getting good print definition in order to achieve reliable finished goods. Indiumt5.1AT was specifically formulated to minimize the impact of downtime on printed deposit volumes, ensuring a consistently high reliability on board assembly, specifically for CSP components.

Decreased defects = higher yields/throughput. The overall result for customers is increased cost savings and finished goods reliability.


Juki Automation Systems - Hall A5, Stand 143

Juki Corporation will showcase the KE-2070 High-Speed Chip Shooter. The successor to the KE-2050, the KE-2070 is a sixth generation high-speed modular chip shooter.

Built upon the one-piece SuperCast™ single casting base that includes the Y beams, KE-2070 is designed with speed, accuracy and reliability in mind. Combined with the new LNC-60 high-resolution laser centering system and an improved magnascale resolution down to 1 ï�­m, KE-2070 is 25 percent more accurate than previous models capable of placing down to 01005 components.

A new head design featuring six nozzles reduces the number of required nozzle changes, improving the rated IPC-9850 speed to 16,000 CPH. This new design also increases the maximum component size that can be placed to 33.5 x 33.5 mm.

The KE-2070 high-resolution laser centering system continues the Juki core technologies of automatic nozzle detection, ensuring the correct nozzle is in use, and component presence monitoring that monitors the presence of the part from pick to place. These features are built into the head making a side trip to a camera unnecessary.

A new multi-nozzle vision centering system (MNVC) is available for use with the KE-2070. This system allows the KE-2070 to be capable of inspecting leaded or BGA parts via an upward looking camera for placement, adding to the versatility of the machine.

The KE-2070 has been designed to be compatible with existing Juki feeders, trolleys and software.


KIC - Hall A4, Stand 146

KIC will be one of four sponsors at the Productronica 2007 special feature "Process Advice and Defect Clinic" sponsored by renowned industry expert Bob Willis. Marybeth Allen will represent KIC during the process clinic.

Available each day of the exhibition, the "Process Advice and Defect Clinic" will provide an opportunity for visitors to obtain free, practical and unbiased process advice and consultancy on common process problems, RoHS compliance and field failures, expertly diagnosed by Bob Willis who has carried out the successful defect clinic at venues around the world.

KIC encourages visitors to bring components and board assemblies to be inspected and tested. Visitors are also invited to email questions and issues ahead of the show to be discussed during the event, via bob@bobwillis.co.uk.

A special "Colour Process Defect Guide" will be available at the show. An invaluable tool for future reference, the Guide will illustrate many of the common defects found in manufacture, including lead-free, together with the possible causes to aid the drive for zero-defect manufacture.

Each day of the exhibition, visitors will be able to visit the clinic with questions, process issues or defects for examination and discussion. This is an ideal opportunity for visitors to gain practical advice on the most common causes of production and in field failure as well as testing boards and components.


Kyzen Corp. - Hall A4, Stand 126

Kyzen Corporation will showcase AQUANOX A4625.

AQUANOX A4625 is a versatile aqueous chemistry designed for optimum effectiveness in cleaning the latest lead-free residues while providing brilliant mirrored solder finishes. This easy-to-use product is environmentally friendly, has a long tank life and is safe for multiple pass applications. A4625 runs at low concentrations and low temperatures, providing consistent results and low cost of ownership. Additionally, it has proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.

AQUANOX A4625 is a biodegradable low-VOC aqueous solution that contains no CFCs or HAPs. The Kyzen Applications Laboratory has evaluated AQUANOX A4625 for effective removal of nearly 300 soldering materials from the world's leading suppliers including, Senju, Alpha, Kester, Indium, AIM, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Certek, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.

AQUANOX A4625 is available in one-, five- and 55-gallon containers.


Landrex - Hall A5, Stand 424

Landrex Technologies, Inc. will be exhibiting exciting new AOI technology at Productronica 2007 - the Optima II 7301™ Express system and the benchtop Optima II 5500™ Sentry.

The Landrex Optima II 7301™ Express is a value-priced AOI system that features high system accuracy and repeatability for the lowest false-flag rate in the industry. Five cameras provide full coverage of all detectable faults at full production line rates, and is ideal for assemblies built with lead-free solder. It includes new E.1 system software with more capabilities including offline programming, barcode reading through the camera, and improvements in the GUI. Landrex Technologies, Inc. purchased the AOI technology developed by Teradyne in April, 2004 and has been successful since then in capturing a significant global customer base. Landrex also offers the industry's fastest and most accurate "post placement/pre-reflow" AOI tool - the Optima II 7250™ OPT, (Optical Process Test).

The Landrex Optima II 5500™ Sentry is the world's first full-featured multi-camera benchtop AOI system offering advantages in speed, efficiency, and reliability. Features include its proprietary Penta-vision 5 camera system, a fast and simple programming wizard, and offline programming; a flexible lighting system for complete defect coverage; automatic laser warp compensation; and more.


OK International - Hall A3 Stand 542

OK International has announced a range of enhancements to its BVX-200 Fume Extraction System.

The proven BVX-200 Fume Extraction System now features brushless motor technology to eliminate wear out of motor parts and increase system lifetime in normal operation. Equipped with this breakthrough new technology, the BVX-200 system now features additional operational advantages including enhanced reliability, zero dust generation and increased motor efficiency due to the elimination of brush friction.

In addition to the new brushless motor technology, OK International's proven fume extraction system now also features a Remote Power Switch for even greater operator ease-of-use. Particularly beneficial for manufacturers who store the system under a workbench, the all new Remote Power Switch is equivalent in size to a computer mouse and can be conveniently located for maximum usability.

The BVX-200 system has also been enhanced with the addition of a new low Air-Flow Alarm designed to immediately alert users to the need to change filters. Ensuring optimal productivity at all times, the alarm eliminates the potential for filters to become clogged, thereby maintaining a highly efficient workflow at all times.


Ovation Products - Hall A4, Booth 431

Ovation Products will display the Magna-Print universal SMT squeegee system.

The Magna-Print system consists of a patent-pending universal fit squeegee holder, infinitely adjustable paste deflectors and corresponding blades to accommodate any PCB size. The quick-change blade holder is equipped with an arrangement of magnets and other features that assist in the firm holding of the blades, thus eliminating the need for tools and loose hardware involved in blade change. Blades are changed in seconds without removing the holders from the machine.

The absence of the conventional blade clamping hardware means that there are no crevasses in which solder paste can accumulate and harden. This easy cleaning feature of the holder is further enhanced by the "no-stick" coating, making it essential for lead-free environments where there are threats of cross-contamination between assembly lines.

Currently the holder fits most DEK, MPM and EKRA printers. The user requires only one set of these holders for each printer regardless of the blade size, eliminating the need to purchase different holders for each blade length as with conventional holders. The system also includes adapters for 45° and 60° mounting, further reducing the requirement for additional holders by the user.

As a further benefit, Ovation offers a return policy that includes shipping costs, based on the customer's complete satisfaction. The product is available through Ovation's worldwide rep network, and more information can be found at www.grid-lok.com.


Practical Components - Hall A4, Stand 480

Practical Components, a distributor of mechanical IC samples or "dummy" components and SMD production tools and equipment, will showcase its latest technology in representative AAT Aston GmbH's booth.

Practical Components' products are designed to help engineers qualify their technology, and train and grow their business while making significant cost savings.

On display will be state-of-the-art Amkor Technology PoP (PSvfBGA), a stackable very thin fine-pitch BGA package; Amkor tsMLF (Thin Substrate Micro LeadFrame-TAPP); the New Sub-100 µm Flip Chip Test Die; and the redesigned Cookson, Indium and AIM Print Test Board and Kits.

Supporting these products is the new 2007 free catalog and design guide that is organized by package type/category with each product accompanied by drawings, description, part number with special attention to lead-free availability and formulations as well as the new CD ROM containing bonus material, CircuitCAM tryout, and gerber and CircuitCAM project files. 


RMD Instruments - Hall A4, stand 339

Winner of two prestigious SMT VISION Awards in the categories of Inspection Equipment and Test, RMD Instruments' LeadTracer-RoHS XRF system was produced under the development direction of Sia Afshari. The system is a major innovation and advancement of the XRF analysis technology, and is the only XRF system designed specifically for the electronics industry to provide fast, accurate and portable screening capability to meet RoHS directives.

The LeadTracer-RoHS XRF system has a unique approach as it analyses the entire body of the components, in a short period of time, rather than simply carrying out a surface analysis. This speeds up the RoHS screening requirements and improves the overall throughput of the quality control process. The LeadTracer-RoHS' ability to analyse the entire energy spectrum eliminates the possibility of false-negative indications in components that otherwise would have found their way into the manufacturing process. The use of non-compatible components such as those containing lead in a lead-free process will result in contamination of the solder pot, which is costly and environmentally undesirable. Elimination of non-compatible components from the process saves time, money, and leads to improvement of the line output. Additionally, the consistent flow of parts will reduce the maintenance and repair of the machinery used in electronics assembly. RoHS directives restricting the use of certain substances in electronics have created numerous challenges in both the screening and implementation process. LeadTracer-RoHS' innovative approach with enhanced detection capabilities provides the screening tool that the industry needs to meet the numerous RoHS directive challenges.

Sample Preparation Stand: The LeadTracer-RoHS XRF system now comes with a sample preparation stand developed with the needs of the end user in mind. The stand has been ergonomically designed for optimum ease-of-use and accuracy and is equipped with RMD Instruments exclusive "quick disconnect" grip to enable the user to operate the hand-held, portable LeadTracer-RoHS as a bench top unit.


Router Solutions GmbH - Hall A2, Stand 171

In addition to showing its complete design-to-manufacture software tools, Router Solutions GmbH will be celebrating its 15th year in business at this year's Productronica show in Munich from November 13th to 16th, 2007.

Built around the industry-leading CAMCAD product line and enhanced by its own in-house developed products, the Router Solutions line gives both OEM and CEM manufacturers the ideal route for getting PCB designs ready for manufacturing in the shortest possible time with the least amount of errors.

Router Solutions' design-to-manufacture process starts with the import of design data from a wide variety of formats. BOM information can come from external files or via a direct link to ERP systems such as SAP, Baan, Navision and others. The resulting complete data set is stored as a single file (.CCZ) upon which all subsequent steps in the manufacturing process are based.

A DFT/DFM module performs detailed analysis of testability rules, assembly spacing rules and solder joint quality, performs probe placement and optimizes test planning. After creating the stencil using CAMCAD's Stencil Generator, the enhanced, analyzed data set can then be output to a wide variety of assembly and AOI machines. The outputted files are "machine ready", with little or no further manipulation necessary.

A highlight at this year´s Productronica is the new release of CAMDOCS 2.0. CAMDOCS allow users to document the entire manufacturing process. Based around the Microsoft Word engine and incorporating all the intelligence of the .CCZ data set, CAMDOCS greatly automates the time-consuming task of creating work instructions by generating color-code drawings and integrating text, pictures, tables and other drawing objects. CAMDOCS users can produce ISO-quality drawings in a fraction of the time. Further ISO compliance is assured via a tracking function for approvals, releases and revisions. The final result can be printed out on paper or released in electronic form and viewed on the assembly line via the CAMDOCS Book Viewer.


SolderStar - Hall A5, Stand 424

New from SolderStar at Productronica 2007 will be the latest evolution of the SolderStar PRO thermal profiling system, featuring a new ultra-miniature datalogger that will enhance the performance and capabilities of the SolderStar profiling range.

Measuring just 100mm x 50mm x 9mm, the smallest profiling datalogger in the industry, is designed to offer a flexible solution to reflow, wave and continuous profiling through its unique Smartlink connection system.

High speed USB connectivity is utilised for reduced data download times and to provide power to recharge the internal high temperature battery, all from one standard USB cable.

As part of a pass-through reflow profiling system, the datalogger attaches by way Solderstar's unique Smartlink system to a range of adapters which provide between 6 and 16 measurement channels in a variety of configurations. The Smartlink system effectively future-proof the system by allowing the channel count to be upgraded in line with the growing complexity of current and future assemblies.

Protected by a new upgraded heatshield system, this new system makes light work of lead-free operation whilst maintaining the smallest footprint for carrier-free operation in restricted tunnel height machines and on tricky narrow PCB applications.

When fitted to the SolderStar WaveShuttle, the SolderStar PRO datalogger becomes a high-end wave solder analyser capable of accurate, repeatable analysis of the problematic wave solder process.

The WaveShuttle fixture is purpose-made for wave solder analysis to which the SolderStar PRO datalogger is attached, again by way of the Smartlink.

For this application, the datalogger monitors top and bottom preheat temperatures, solder pot temperatures and chip and main wave contact over multiple points through the wave. Along with dedicated wave solder PC software, the system offers users industry-leading automatic graphical process analysis and process SPC capabilities in an easy-to-use package.


Speedprint - Hall A4, Stand 125

Speedprint Technology Ltd. will showcase the SP200avi Inline Stencil Printer.

SP200avi is a revolutionary addition to the Speedprint range of stencil printers. Designed for medium and high throughput, high-mix applications, the 23" inline stencil printer delivers outstanding performance and value.

The system uses a unique, patent protected "look down, look down" approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure accurate and repeatable precision alignment using fiducial marks or PCB/stencil features. This innovative vision system facilitates a unique "paste on stencil" inspection feature that enables users to determine if there is adequate paste on the stencil before running the print cycle.

Speedprint's patent protected Selective Auto-Paste Dispense technology is fully programmable. The user interface runs under a menu-driven, Windows XP™ application and is simple to operate. The software incorporates comprehensive self-diagnostic capabilities, including production logging and automatic fault report generation

Data stored on the machine may be accessed remotely via a PC modem connection, allowing for "on the fly" troubleshooting. Ease of maintenance and low cost of ownership are key characteristics of the SP200avi.


Universal Instruments and Valor - Hall A4, stand 460 & Hall A5, stand 312

Universal Instruments Corporation (UIC) and Valor Computerized Systems Ltd. have established a partnership to deliver a new, best-in-class NPI solution for UIC assembly machine users, based on Valor's vPlan production planning tool. The new product will be unveiled at the Productronica tradeshow.

The new product, titled "Dimensions Data Prep Studio", will integrate with UIC's Dimensions Programming and Optimization software (DPO) to provide advanced process preparation capabilities including comprehensive CAD/CAM translation, advanced Gerber support and the ability to view and verify results on a graphical representation of the board.

Powered by Valor's world-renowned technology, "Dimensions Data Prep Studio" will provide users with high performance and superior usability through easy-to-follow workflows.

Commenting on the selection of Valor's tool, Greg Benoit, Product Manager of Dimensions Line-level Software at UIC said: "We found Valor's data preparation technology to be best-in-class, making it the ideal front end to our Dimensions Programming and Optimization product. This winning combination provides our customers with an extraordinary level of flexibility and efficiency in turning their design data into Universal machine product data."

Scott Gerhart, Director of Genesis Platform at UIC, also commented on the new partnership: "Universal Instruments has long been recognized as a leader in the design and manufacturing of best-performance, best-value SMT assembly solutions. We view this partnership as a win for Universal, Valor, and most importantly, the customers of both companies. Genesis and AdVantis customers will now enjoy the finest CAD, Gerber and BOM data import tools available in the industry, and Valor customers will be in a position to select Universal SMT solutions with confidence in seamless integration to design and materials data."

"We welcome Universal Instruments to our OEM partnership program," said Julian Coates, VP Assembly Market at Valor. "We believe that partnerships such as this provide electronics manufacturers with the tools to deal with today's dynamic manufacturing environment, and we intend to ensure that both Valor's and UIC customers get the most benefit out of this cooperation."


VJ Electronix - Hall A5, Stand 324

VJ Electronix will showcase the Vertex Series-A X-Ray Inspection System.

To meet significant industry challenges, the Vertex Series-A X-Ray Inspection System offers numerous features to help customers to inspect PCB and component assemblies quickly and accurately. A new Flexible Design allows it to be customized to any Inspection Task.

The Vertex Series-A allows for faster load/unload product exchange; reproducible results based on repeatability of closed-loop control system.

The system offers an inspectable area of 508 x 610 mm (20 x 24") with 100% coverage. The large board-handling table and large inspection area are especially important to suit server boards and other large assemblies. Its modular configuration allows customers to select multiple choices of tube, detector and motion components as well as Software Options to optimize the system for any application. Automation of the Vertex Series-A allows one operator to run multiple machines. Also, the large sample tray means multiple small to medium sized assemblies can be loaded at the same time.

The ergonomic design of the Vertex Series-A offers an adjustable operator console, sliding door, large window and easy sample loading. With the table moved next to the Door, heavier assemblies may be loaded into the machine with minimal physical effort. The use of sealed X-Ray tubes minimizes the maintenance efforts and the whole system is designed to be maintenance and service friendly.


XJTAG - Hall A1, Stand 448

XJTAG, a supplier of IEEE Std. 1149.1 compliant boundary scan development tools, has announced version 2.0 of its popular XJTAG boundary scan development system, which sets a new standard for speed and accuracy of printed circuit board (PCB) debug and test.

The new version of the XJTAG system - which is used throughout the electronic product life cycle by board developers and manufacturers to debug, test and program complex Ball Grid Array (BGA) populated printed circuit boards and systems - will be unveiled by XJTAG at Productronica.

XJTAG 2.0 has a raft of new features, including automated JTAG chain discovery and set-up, a built-in netlist explorer, optimised memory test, and real-time design for test (DFT) coverage tracking. It also includes an ever growing library of device-centric test scripts, improved integration with LabVIEW, and support for Xilinx's Virtex-5 FPGA System Monitor.

With version 2.0, XJTAG has introduced a drag-and-drop interface that automates the JTAG chain discovery and set-up process, thereby saving engineers time and hassle. The developer simply connects the computer to the unit under test via the USB2.0 XJLink hardware module, creates a new project, and adds the target board.

The XJTAG system then detects the scan chain and matches the JTAG device codes to their respective BSDL files, as well as identifying ground nets and making intelligent suggestions about other components.

Other enhancements include an optimised memory test, real-time Design For Test (DFT) coverage analysis, an extended library of device-centric test scripts, and improved integration with LabVIEW and other leading test executives. XJTAG has also added support for Xilinx's Virtex-5 FPGA System Monitor to enable customers to check power supplies or perform overall thermal management using the JTAG port on the 65-nm Virtex-5 FPGAs.

The XJTAG development system is a cost-effective 'out-of-the-box' solution for debugging, testing and programming electronic printed circuits boards and systems throughout the product lifecycle.


X-Tek - Hall A2 Stand 481

X-Tek Group, the manufacturer of real-time microfocus x-ray systems will be demonstrating Computer Tomography (CT), at Productronica.

CT is a non-destructive x-ray inspection technique that produces high-resolution 3D datasets which can be viewed at any angle, sliced in any direction and measured to enable detailed analysis of the internal structure of a wide range of components and objects. CT has been introduced to X-Tek's established Revolution X-ray system and is available with many other X-Tek systems.

The Revolution will be exhibited with a new Megapixel high dynamic range digital x-ray detector for inspecting a variety of difficult to image features including underfill and micro-void inspection in BGA components.

Also on display will be the newly released Plated Through Hole (PTH) software package for InspectX. The PTH package provides manual and automated pass/fail inspection of solder levels inside multi pin connectors and is now supplied with all of X-Tek's electronics inspection systems. For further information go to www.xtekxray.com