IPC releases schedule of courses

IPC has released its schedule of professional development courses for the 2003 IPC Annual Meeting, taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, USA. One full- and seven half-day courses will be held on Monday, September 29 and Thursday, October 2. In this year’s schedule, participants will be able to remain in the forefront of electronics interconnection advances by discovering the latest data on lead free solder surface finishes, embedded resistors and laser trim. Attendees will also gain a better understanding of how to better manufacturing processes and increase their company’s return on investment. The full-day course offered on October 2 is Lead Free Soldering: Metallurgical Fundamentals Reflow Application and Challenges—designed to provide a thorough understanding of the fundamental design considerations of lead free alloys, with emphasis on metallurgical properties analysis. Among the half-day courses being offered on both dates are Reliability Issues for Lead Free Solders, Lead Free Surface Finishes and Compatibility with Lead Free Soldering, Embedded Passives Laser Trim, and Understanding National Technology Roadmaps.For more information, visit www.ipc.org/annual Source: PCBnewsline