SMTA China to host SMTA China South Conference 2007

SMTA China announces that it will sponsor the upcoming SMTA China South Conference 2007. The conference will be supported by Reed Exhibitions in conjunction with the Nepcon China 2007 exhibition at the Shenzhen Convention & Exhibition Centre and is scheduled to take place 27-30 August 2007 in Shenzhen, PR China.

Organized by the SMTA China - the world's leading user group for surface mount and companion technologies in China - this comprehensive event features technical papers, workshops and training sessions as well as an Emerging Technologies Summit and three focused symposia across seven tracks: Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, Process Control, and Contract Manufacturing/Business Issues.

The SMTA China South Conference Program covers the hottest topics in the industry. Attendees will gain valuable skills and knowledge that can be put to use immediately - skills that enhance attendees' competitive edges and can advance their careers. Conference topics include 01005 Assembly, 3-D System in Package (SiP), Package on Package (PoP), Lead-free Reliability, Component Supply Integrity, Legal Responsibility of Non-RoHS Part/Product Entering Europe, Materials and Process Characterization, and Flex Circuit Assembly.

For more information about the SMTA China South Conference or to register to attend, contact Ms. Peggy Chen at +86-21-5609-3010; fax: +86-21-5609-3020; E-mail: peggy@smta.org.