FINETECH to highlight motorized FINEPLACER Lambda at ECOC 2007
Aug 29, 2007
Offering innovative equipment solutions for most rework or micro assembly challenges, FINETECH will showcase the motorized FINEPLACER® Lambda high-precision bonder in booth 13011 at the 33rd European Conference and Exhibition on Optical Communication (ECOC), scheduled to take place September 17-19, 2007, in Berlin, Germany.
The high-accuracy bonding platform provides a placement accuracy of ± 0.5 µm and is suitable for a multitude of applications. At the ECOC exhibition, the Lambda will focus on the bonding of single lasers and laser bar bonding.
The motorized configuration of the FINEPLACER® Lambda provides auto-touchdown and die placement, as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the motorized machine include hands-off die placement; improved process repeatability - pilot production worthy; placement of die with dimensions that exceed the optical field of view; up to 10 programmable microscope positions; upgradeable with integrated microscope measurement function and a placement mask generator.
Applications for the Lambda include eutectic soldering, Au/Sn soldering, Indium bonding, thermo compression, thermo-/ultrasonic bonding and adhesive technologies.