Henkel appoints new VP of PD&E for Semiconductor and Assembly Technologies
Aug 31, 2007
The company has announced the promotion of Dr. Michael Todd to the position of Vice-President of Product Development and Engineering for Semiconductor and Assembly Technologies, a move which will serve to further enhance the resource focus and technical vision for Henkel's engineering teams worldwide.
Having played an essential role in crafting Henkel's product development strategy over the last several years, Todd has led the Irvine, California-based teams responsible for mold compound, die attach, wafer-level underfill and CSP underfill materials. In his new role, Todd will maintain his oversight of Henkel's Irvine applications engineering and product development initiatives, while expanding his duties to oversee product roadmaps at the company's Yantai, China, Linyuangong, China, Tainan, Taiwan and Hemel Hempstead, UK facilities as well.
"Henkel is leading the market in total value chain materials solutions," states Todd. "Ensuring that our research, development and applications efforts continue to align with customer requirements in specific regions is central to our strategy and key to maintaining Henkel's top market standing and sustained, long-term growth. I look forward to working with the teams in all of our labs worldwide as we continue to set the industry benchmark for advanced materials design."
Previously, Dr. Todd was Henkel's Director of RD&E for Material Sets and has spent the last 9 years of his career at the company in various engineering and materials development roles. Throughout his career, Todd has authored numerous conference papers and technical articles and was recently named to the advisory board of Advanced Packaging magazine. As Vice-President of PD&E, Todd will be based in the company's Irvine, California Research and Applications Center.
For more information visit www.henkel.com/electronics