JPSA provides systems to Tekcore Co. Ltd.
Jul 17, 2007
J P Sercel Associates (JPSA), the world's leading designer, supplier, and systems integrator of laser materials processing workstations, has announced the sale of two (2) IX-210 ChromaDice™ wafer scribing systems and an IX-260 ChromaLift™ LLO (LED Lift-Off) system to Taiwan's TEKCORE Co., Ltd., one of the world's leading suppliers of high-brightness LED wafers and chips.
Mr. Nithi M.Nithipalan, President & CEO of Tekcore, said, "We chose JPSA laser systems because JPSA is the recognized market leader in front-side scribing technology. It is important to us to maintain our global leadership position and to provide the best possible product to our customers worldwide. JPSA equipment helps us do this, with systems that produce more die per wafer and industry leading throughput."
The JPSA IX-210 ChromaDice™ is a UV laser workstation equipped with a diode-pumped solid state (DPSS) laser, and is a Class 1 industrial-grade system designed for high-volume wafer singulation. The UV laser singulation process is a fast, low-stress method of singulation that minimizes chip breakage after cutting, for higher yields, with kerfs as narrow as 2.5 microns, and generates minimal debris. The UV singulation process is vibration-free, unlike mechanical processing, which can cause chipping and micro-cracking of the wafer, resulting in unacceptable cut quality and poor die-edge fracture strength.