LGA & QFN Practical Design, Assembly & Rework Workshop from Soldertec
Jul 17, 2007
Soldertec Global and Bob Willis, of EPS, will be running their latest practical workshop which will assist engineers using LGAs (Land Grid Array) and QFNs (Quad Flat No-Lead) devices in their design and assembly of their products.
The workshop will take place on Wednesday 24th October 2007 at the laboratories of Tin Technology in St Albans, Hertfordshire. In addition, the popular ‘Step by Step Failure Analysis' workshop will be held on the following day, on Thursday 25th October.
LGAs and QFNs have become increasingly common package types used in many professional portable products. This workshop is designed for not only for engineers, but also supervisors and quality engineering staff who are faced with assembling new products incorporating these devices. The cost of the workshop is £150 + VAT and includes refreshments, workshop notes and a training CD-ROM.
"With any new device there is always a learning curve for Design, Process and Quality Engineers, who have to get to grips with the challenges that these leadless packages bring," comments Course Leader, Bob Willis. "Inspection and quality control (with the higher temperatures of lead-free soldering) plus rework, are just some of the challenges being faced."
During the afternoon session of the workshop there will be an opportunity to examine sample joints with high resolution X-ray and SEM (Scanning Electron Microscopy), understand how to microsection packages, test parts for RoHS compliance and assess solderability of the terminations.
Further details of both of these workshops and a booking form can be downloaded at: www.ASKbobwillis.com/LGAworkshops.pdf.