EIPC Summer Conference - two days left to register
Jun 12, 2007
On 14th & 15th June EIPC will be running its Summer Conference in the city of Edinburgh.
In a very full day and a half, it will be covering such topics as micro-drilling technology; rigid-flex fabrication; HDI for performance optimisation; a new OSP for lead-free solders; a closer look at ENEPIG; a new Immersion Silver process; verifying microvoid mechanism and prevention measures from an optimized immersion silver chemistry; managing layer stack-up communication across the supply chain; ultra-thin embedded passives materials in printed circuit boards; copper via-fill; REACH & laminates; sono-chemical surface treatment amongst a raft of subjects.
This is a conference for the high-technology PCB company, wherever they may be in Europe, as it allows them to see what is now available, and what is just over the horizon.
For more information, visit www.eipc.org