HyperBGA® delivers higher speeds and more reliability than ceramic BGAs

HyperBGA® from Endicott Interconnect Technologies is a PTFE-based coreless semiconductor package that enables silicon devices to run at extremely high speeds. The combination of the low loss, low dielectric constant material and strip line cross sections enables signal speeds surpassing 12 Gb/s. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane, enables HyperBGA® to provide long field life, with none of the BGA wear out, die cracking, delamination or flip chip bump fatigue of other packages.

This solution, available as a single-chip module or SiP, offers the longest overall board level flip chip BGA life available, and it delivers 2-10x the flip chip BGA package reliability of ceramic BGAs. HyperBGA® is assembled using standard SMT processes and materials, making columns or land grid array sockets unnecessary. It is capable of flip chip, SMT or CSP component attach on both sides.

HyperBGA® provides full strip line structures, low coupled noise, low weight and very low power distribution inductance, and the compliant laminate minimizes die and BGA stress when using large die and large body sizes.

Applications
The HyperBGA® product line is an excellent solution for networking, high end server, telecommunications, aerospace, military and medical applications where speed, reliability and increased signal I/O, along with reduced weight, height and overall package size (SWoP), are critical. This low stress flip chip laminate package is also ideally suited to graphics applications that require high data processing speeds, or any application requiring a system-in-package (SiP) approach.

For more information on the HyperBGA®, visit www.eitny.com