Heraeus at Semicon West
May 14, 2007
Heraeus Contact Materials Division (CMD) will showcase one of the industry's most comprehensive portfolios of semiconductor assembly materials - including a new line of water-soluble ball dip pastes for solder on pad (SOP) substrates - at SEMICON West 2007/Booth #8411, 2nd floor Final Manufacturing Hall.
The BD paste series enables manufacturers to utilize SOP substrates while maintaining outstanding yields. Since the convex surface of the SOP substrate causes solder ball movement during reflow when using the traditional flux and drop process, the BD paste allows the balls to be dipped in solder before placement. This prevents ball movement and eliminates the need for printing of solder paste or flux.
Heraeus CMD will also be featuring an expanded line of conductive adhesives for connection of electronic (SMDs) and bare dies with lead frames and ceramic or LTCC circuits. These thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesives provide outstanding electrical and thermal conductivity and excellent reliability performance at high temperature, humidity and after-temperature cycling.
At this year's SEMICON West show, Heraeus will also spotlight its F510 wafer bumping solder paste especially developed for flip chip technology. Designed for water clean applications, the F510 paste provides for excellent wetting and is capable of printing down to 6 mil (150 microns) pitch.
Another innovative Heraeus product which will be featured is the TF Series of tack fluxes which are highly compatible with today's lead-free processes and most underfill materials on the market. Heraeus TF Series fluxes for the semiconductor market are available in no-clean, solvent-clean, and water soluble versions and have outstanding print and dispense capabilities for maximum yields.
In addition to TF Series fluxes, Heraeus Contact Materials Division will exhibit its bonding wire and ribbon, lead-free solder pastes, and the Welco line of fine solder powders (Type 5, 6, 7 and 8).