Value-Added Microelectronic Packaging from Palomar Technologies
May 14, 2007
Palomar Microelectronics offers volume manufacturing services
Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, will announce its high value-added microelectronic packaging services at SEMICON West 2007 at booth #7514.
Palomar Microelectronics is a fast growing segment of the company created by the demand for quick-turn product development, prototyping, test, and assembly services. Microelectronic assembly processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.