Amkor and UTAC enter into cross-license agreement
May 18, 2007
Amkor Technology, Inc. and United Test and Assembly Center Ltd. have announced that they have entered into a multi-year cross-licensing agreement under which Amkor will license its MicroLeadFrame® patents to UTAC, and UTAC will license its QFN patents to Amkor. The agreement covers the license of intellectual property rights and transfer of associated packaging technologies.
MicroLeadFrame, or MLF®, is Amkor's proprietary version of an integrated circuit package with the generic nomenclature of QFN, which stands for "quad, flat-pack, no lead." Amkor's MLF package is a leadframe-based, nearly chip-scale package with an exposed die paddle and leads on the bottom of the package, providing excellent thermal and electrical performance. Since its introduction in the late 1990's Amkor has seen broad adoption of its MLF technology, and over the past five years, Amkor has shipped approximately five billion MLF packages.
"Our MicroLeadFrame package has been widely adopted by IC suppliers as a cost-effective alternative for conventional low lead-count packages, and MLF continues to be vital to the success of Amkor's leadframe and CSP product lines," said Oleg Khaykin, Amkor's Executive Vice President and Chief Operating Officer. "We are pleased that UTAC has sought to adopt our technology."
Lee Joon Chung, UTAC's Group President and CEO, noted "These QFN products are a key part of our assembly strategy, and we are pleased to have entered into a cross licensing arrangement on the MLF / QFN products with Amkor."