Low profile stage for wafer chucks from New Way Precision
Jun 19, 2003
New Way Precision has announced its new Super Z™ stage, a low profile stage that provides fully parallel and ultra smooth support for wafer chucks without linear bearings. The Super Z™ is designed to take the place of coarse and fine Z stages for wafer metrology and processes with standard travels beyond 20mm and direct reading resolutions to 5nm. Parallelism of an arbitrary plane to the base is as little as 1 micron TIR. The Super Z™ is said to have significant advantages over conventional designs, and virtually all XY uncertainty throughout its travel is eliminated when used with a ball screw or voice coil actuator. Designed for billions of cycles, the Super Z™ requires no maintenance, and is vacuum compatible. Licensing opportunities for the Super Z™ are available through New Way Precision. See the Super Z™ at SemiCon West, booth 4027 or for more information visit www.newwayprecision.com/superZ.Source: PCBnewsline
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