EIPC Summer Conference Edinburgh 2007
Apr 09, 2007
United Kingdom: June 14 & 15, 2007, Radisson SAS Hotel
On 14th & 15th June EIPC will be running its Summer Conference in the wonderful city of Edinburgh.
In a very full day and a half, it will be covering such topics as micro-drilling technology; rigid-flex fabrication; HDI for performance optimisation; a new OSP for lead-free solders; a closer look at ENEPIG; a new Immersion Silver process; verifying microvoid mechanism and prevention measures from an optimized immersion silver chemistry; managing layer stack-up communication across the supply chain; ultra-thin embedded passives materials in printed circuit boards; copper via-fill; REACH & laminates; sono-chemical surface treatment amongst a raft of subjects.
This is a conference for the high-technology PCB company, wherever they may be in Europe, as it allows them to see what is now available, and what is just over the horizon. Maintaining that technological edge is vital; however good the service, however good the price, however good the delivery, if you are not informed, you are not in the market.
If you join as a new member for the year 2007, and pay your subscription fee before 1st June 2007, you will receive one free Full Conference Delegate Pass. (Please note: if the membership fee will be €500,- based on the annual turnover, the company has to become a member for 2 years). The membership application form is available through the EIPC website.
For more information, visit www.eipc.org