RVSI showcases WS-3800 series
Apr 24, 2007
RVSI Inspection LLC, is displaying its WS-3800 series wafer inspection system.
WS-3800 features the ability to detect surface defects on 300 mm wafers using gold bump technology. Additionally, it offers production-speed inspection of gold bumps for nodule and crater detection. The WS-3800 offers the overall ability to find surface and bump defects on 300 mm wafers, in addition to its superior 3-D technology.
While the WS-3800 offers the highest 3-D accuracy for the inspection of the height of gold bumps, customers are also interested in the detection of nodules and craters in the surface of the gold bumps. In order for the LCD driver chips to properly adhere to the glass panels, the gold bumps must be of uniform height and free of any defects such as nodules or craters. The customized lighting developed by RVSI allows the system to capture these defects at the highest speeds and, more significantly, with minimum overkill.
RVSI's WS-3800 wafer inspection system offers the industry's best combination of production-speed, 2-D surface defect inspection and 3-D bumped wafer metrology. Depending on features, systems sell for $500,000 to more than $1 million.