Kester is displaying its EM918AP lead-free, no-clean solder paste in booth 2G30.
Kester's EnviroMark 918AP is a lead-free, halide-free, air- and nitrogen-reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free SAC alloys.
EM918AP exhibits excellent printing characteristics on fine pitches (0.4mm/16 mil). The paste's robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. It offers a clean cosmetic appearance in the reflowed solder joints with smooth solder and light-colored residues, closely resembling tin-lead joints. It is resistant to slump, has excellent brick definition and offers stable tack life.
EM918AP also provides superior wetting to a wide variety of lead-free metallizations, including OSP coated, immersion tin and immersion silver boards and Ag/Pd components. It is classified as Type ROL0 flux under the IPC ANSI/J-STD-004A Joint Industry Standard and is Bellcore GR-78-CORE-compliant.
