DfR Solutions to present research at IPC/JEDEC Conference
Mar 27, 2007
Joelle Arnold of DfR Solutions will present information on DfR's recent research study: "Accelerated Life Testing of SN100C for Surface Mount Devices: Vibration" at the IPC/JEDEC Global Conference on Lead Free Reliability & Reliability Testing for RoHS Lead Free Electronics. The conference will be held April 10-12 in Boston, MA.
The need for a manufacturable, reliable lead-free solder is becoming increasingly important as Sn alloys containing Ag-Cu (SAC) experience difficulties in manufacturing and field performance. This report will detail DfR's approach towards developing a physics-of-failure based life model for vibration of SN100C.
For more information on the study, contact Joelle Arnold at JArnold@DfRSolutions.com. For more information regarding the conference, visit firstname.lastname@example.org.