DfR Solutions to present research at IPC/JEDEC Conference

Joelle Arnold of DfR Solutions will present information on DfR's recent research study:  "Accelerated Life Testing of SN100C for Surface Mount Devices: Vibration" at the IPC/JEDEC Global Conference on Lead Free Reliability & Reliability Testing for RoHS Lead Free Electronics.  The conference will be held April 10-12 in Boston, MA.

The need for a manufacturable, reliable lead-free solder is becoming increasingly important as Sn alloys containing Ag-Cu (SAC) experience difficulties in manufacturing and field performance.  This report will detail DfR's approach towards developing a physics-of-failure based life model for vibration of SN100C.

For more information on the study, contact Joelle Arnold at JArnold@DfRSolutions.com. For more information regarding the conference, visit registration@ipc.org.