RVSI announces multiple orders for lead scanner and wafer inspection systems
Mar 29, 2007
RVSI Inspection LLC has announced the receipt of numerous orders for both its Lead Scanner and Wafer Inspection Systems.
The first is a multiple unit order for its Lead Scanner replacement program including the new package visual inspection and the new lead-free ball sensor from a major multinational facility. The order was placed by the company's division in Asia. The replacement program provides a very cost-effective solution to bring current systems up to speed with the latest technology both for lead inspection and package visual inspection.
RVSI also announces that it has received orders for LS8800, its latest lead inspection system, from a major facility in China. After evaluating different systems in the market, the customer decided that RVSI provides the best solution in terms of overall technology, cost effectiveness, and a service and support solution.
RVSI Inspection also has received orders for its wafer inspection system from customers in Taiwan and in the United States by providing an inspection solution for surface defect as well as 3-D inspection of gold bump and solder bump wafers. The fact that this system can provide 3-D bump metrology, surface defect and bump defect both for gold bump and solder bump wafers made this solution very attractive for the customer.