AIM announces development of lead-free solder paste

AIM has announced the development of its NC254 lead-free pin probe testable no-clean solder paste, designed to improve the throughput and increase the efficiency of the most advanced SMT applications. NC254 is described as an all-purpose lead-free, pin probe testable no-clean solder paste formulated to perform well in virtually any SMT application and is said to offer broad process windows for printing, reflow, and pin probe testing. NC254 has a 12 month refrigerated / 6 month room temperature shelf life and is available in a wide-variety of powder mesh sizes, alloys, and all conventional packaging. NC254 passes all applicable Bellcore and IPC reliability testing. Source: PCBnewsline