SEMI publishes eleven new technical standards
Feb 16, 2007
SEMI has published eleven new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.
SEMI Standards are published three times a year. The new standards, part of the March 2007 publication cycle, join more than 740 standards that have been published by SEMI during the past 34 years.
The newly released standards include a guide for equipment data acquisition, a test method for evaluation of line-edge roughness and linewidth roughness, and a communications specification for the MECHATROLINK protocol.
"The new SEMI standards documents will help provide the industry with solutions for critical challenges in factory automation, substrates, and metrics for manufacturing efficiency," said Bettina Weiss, SEMI director of International Standards.
The new standards released today include:
Test Method for Measurement of Bent Cold Cathode Fluorescent Lamps
Specification for Reference Position of Substrate ID to Specify Datum Line for ID Reader for Handing off/on Tool
Specification of Sensor/Actuator Network Communication for MECHATROLINK
Guide for Equipment Data Acquisition (EDA)
Specification for Size Ranges of Stainless Steel Canisters to Contain Liquid Chemicals
Specification of Grand Concept of Map Data for Characteristics of Dice on Substrate
SEMI M68 (Preliminary)
Practice for Determining Wafer Near-edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD
SEMI M69 (Preliminary)
Practice for Determining Wafer Near-edge Geometry Using Roll-off Amount, ROA
SEMI M70 (Preliminary)
Practice for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness
Standard Test Method for Step-Height Measurements
Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness