SEMI publishes eleven new technical standards
Feb 16, 2007
SEMI has published eleven new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org. SEMI Standards are published three times a year. The new standards, part of the March 2007 publication cycle, join more than 740 standards that have been published by SEMI during the past 34 years. The newly released standards include a guide for equipment data acquisition, a test method for evaluation of line-edge roughness and linewidth roughness, and a communications specification for the MECHATROLINK protocol. "The new SEMI standards documents will help provide the industry with solutions for critical challenges in factory automation, substrates, and metrics for manufacturing efficiency," said Bettina Weiss, SEMI director of International Standards. The new standards released today include: SEMI D47
Test Method for Measurement of Bent Cold Cathode Fluorescent Lamps SEMI D48
Specification for Reference Position of Substrate ID to Specify Datum Line for ID Reader for Handing off/on Tool SEMI E54.19
Specification of Sensor/Actuator Network Communication for MECHATROLINK SEMI E147
Guide for Equipment Data Acquisition (EDA) SEMI F103
Specification for Size Ranges of Stainless Steel Canisters to Contain Liquid Chemicals SEMI G81.1
Specification of Grand Concept of Map Data for Characteristics of Dice on Substrate SEMI M68 (Preliminary)
Practice for Determining Wafer Near-edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD SEMI M69 (Preliminary)
Practice for Determining Wafer Near-edge Geometry Using Roll-off Amount, ROA SEMI M70 (Preliminary)
Practice for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness SEMI MS2
Standard Test Method for Step-Height Measurements SEMI P47
Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
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