New DTI/Industry Project - an urgent opportunity - response needed by March 1st 2007

Measuring the effect of LF soldering tTemperatures on large plastic components stability

A new studio project is announced by NPL, National Physical Laboratory, to bring together interested parties who need to develop an understanding of how changes in lead-free soldering profiles are affecting the stability and reliability of components.

European RoHS legislation has lead to increasing processing temperatures and longer dwell times during both the reflow and wavesoldering process. Components considered suitable for lead-free soldering have deformed during soldering, leading to misalignment and solder joint reliability problems. This project will provide industry with a best practice guide on how to minimise the effects on components from the lead-free solder profile.

Likely partners will be: end users wishing to obtain a better understanding of this problem and how to correct it, component manufacturers, solder equipment manufacturers.

Included in the deliverables will be a best practice guide for minimising component damage during lead-free soldering and a report evaluating the effects of lead-free processing on the stability of electronics components.

Full details at http://www.npl.co.uk/ei/studio/stability/stability2.pdf