Heraeus CMD offers portfolio of products
Feb 21, 2007
The Contact Materials Division of Heraeus displayed its array of products made possible with the 2005 acquisition of the ultra-fine-pitch solder powder technology and business from Welco GmbH in Potsdam, Germany. With this acquisition, Heraeus CMD is continuing its strategy of offering special high-quality materials for the joining technology in the semiconductor and SMT industries.
Heraeus has developed a series of solder pastes that allow BGA manufacturers to utilize solder on pad (SOP) substrates while maintaining outstanding yields. The BD41 Series of pastes allow the balls to be dipped in solder before placement preventing ball movement and the need for printing of solder paste or flux. The BD41 Series pastes feature Type 5 or Type 6 highly spherical powder, are water cleanable, and are available in both lead-based and lead-free material sets.
Another water cleanable solder paste with excellent wetting capabilities is the F510 Series of wafer bumping pastes from Heraeus. The small aperture diameters and narrow spacing typical of die pad configurations dictate a much smaller particle size (usually Type 6) than standard SMT (Type 3 powders).
For surface mount assembly applications where a lead-free, no-clean solder paste is desirable, the F640 Series from Heraeus offers excellent wetting properties for exceptional print-to-print consistency. Available in all standard alloys with Type 3 powders, Heraeus can also supply the paste in Type 4 and Type 6 powders.