APEX exhibitor preview IV

In less than two weeks much of the electronics manufacturing industry will descend on Los Angeles, California for APEX.  Here, in the forth of a number of previews, are some of the exhibitor highlights

If you wish to have your company included a further APEX preview, please email details to ediors@emsnow.com before Februaury 14th.

see also APEX exhibitor preview I, APEX exhibitor preview II and APEX exhibitor preview III

Aqueous Technologies - booth 1109

The C3 - Critical Cleanliness Control - ionic cleanliness tester was developed by Forsite, a leading analytical test laboratory specializing in residue characterization for the electronics industry.  Aqueous Technologies, a leading manufacturer of automated defluxing systems and cleanliness testing equipment for the electronics industry has been appointed as the exclusive worldwide distributor of C3.

C3 is unique from other contamination testers on the market.  It is the first tester to examine contamination in a localized area of a PCB assembly.  By looking at a localized area of 0.1 in2, the C3 ionic cleanliness tester provides immediate feedback as to whether or not the area is ionically "clean" or "dirty."  The localized testing format of the C3 allows users to look at specific components or areas of circuitry that are particularly sensitive and prone to performance issues.

By using the C3 Tester, the presence of conductive or corrosive residues can be detected quickly and effectively.  The system is designed for efficiency and provides the immediate process monitoring data that an off-site testing facility cannot.  With a user-friendly touch-screen, the C3 pinpoints the problem areas that need further analysis.  When further analysis is needed, users can send off the sample collected by the C3 for further testing to determine exactly what contaminants are present.

C3 is the only cleanliness testing method capable of determining where a contaminant is, the level of contamination and what the contamination is.  C3 collects and stores samples of the extracted contaminant. The stored sample may be sent to the Forsite laboratory for identification via Ion Chromatography (for an added fee).

BPM Microsystems - Booth 2223

BPM Microsystems will showcase 4710, an automated programming system at the event.

The 4710 is designed specifically for today's highest density devices and their longer programming times, making it the fastest at programming Flash, while still offering the versatility to program Microcontrollers, FPGAs, PLDs and all other device types.

By taking advantage of the proven 7th generation technology, BPM Microsystems has improved the site hardware to allow the capability of programming devices with densities up to 4 Gbits. Additionally, the company has incorporated the industry's widely accepted high-speed USB 2.0 standard bus for communications.

By combining the fastest universal programming technology - 64 Mb in 15 s - and BPM Microsystems' FX4â„¢ socket modules, which can program up to four devices simultaneously, the 4710 can program up to 44 devices at the same time, resulting in four times the throughput.

CyberOptics - Booth 2561

CyberOptics Corporation will exhibit SE 300 Ultra with MicroPad Sensor technology at APEX.

The MicroPad sensor is a new sensor on the SE 300 Ultra platform that can measure solder paste on pads down to 100 x 100 um, (paste height, area and volume measurements with Gage R&R < 10 percent). CyberOptics is building on its standard high-performance SE 300 system with a sensor upgrade that offers higher magnification of very small solder paste pads. It is ideal for batch inspection of system-on-chip and flip chip applications as well as NPI process qualification. The MicroPad sensor on the SE 300 Ultra can be interchanged easily with a standard sensor so that customers can operate in both modes with a single machine by simply swapping the sensors.

Base features of the SE 300 Ultra industry-leading 100 percent 3-D solder paste inspection system include technology-leading 01005 pad inspection capabilities, ability to handle odd-shaped pads, superior paste height accuracy and an XML file format output for easy integration to shop floor control systems.

Also during APEX, CyberOptics will unveil an improved version of the SE 300 Ultra operator interface with new easy-to-use features. This is a simpler interface for operators that provides a more common look and feel with the Flex Ultra user interface. It is offered in English, Japanese, Korean and Chinese, and is capable of being translated into any language.

ESSEMTEC - Booth 2259

ESSEMTEC will introduce its SP900 In-line printer, automatic and sophisticated enough for high-mix/high-speed production. The printer is designed for multi-shift operation with a minimum of service.

The integrated stencil cleaner is programmable, and closed ball rotation spindles drive the maintenance-free print head. All moveable parts are protected against dirt.

The printer is very flexible and provides a fast changeover. Additional features include reliable and precise printing, user's choice of lighting color, board thickness from 0.33 to 5.0 mm, automatic stencil entry and alignment, and automatic width adjustment. Also, the system can accommodate stencils or screens up to 29 x 29".

SP900 offers accuracy of 10 um. It precisely centers stencils on the substrate. Additionally, both reference tag and print structures can be used for adjustment. The unique dual-camera system compensates for stencil distortion or board variations. For maximum contrast, the lighting color of the vision system is programmable (RGB LED illumination).

Eunil - Booth 1051

Eunil H.A. Americas Inc., will highlight its Label Master 1100P label attachment system.

Typically, attaching labels to PCBs is both labor-intensive and inconvenient. However, Eunil's new, fully automated Label Master 1100P system changes this by eliminating the error caused by humans, and increasing both productivity and traceability.

Using the label attachment system, SMEMA communication is used to stabilize the PCBs during label placement, as well as both a front stopper and side gauging device in the conveyor. Label Master 1100P can dispense printed labels through the label printer or a pre-printed label on a roll. Labels are placed on the PCB with the use of a robot placement positing system.

Numerous options also are available for the system: 1- or 2-D scanner label verification, a fiducial-based board orientation/label centering vision camera and TCP/IP data communication is available.

EVS International - Booth 2758

EVS International will introduce the EVS 1000 solder recovery system in Sono-Tek's booth at APEX 2007.

The EVS 1000 is a smaller, lighter version of the popular EVS 3000/6000, with all of the recovery performance of the standard and lead-free solder units. The smaller size and footprint help reduce the cost, but still provide a capacity of 10lb/5kg of dross, giving a rapid payback and impressive return on capital employed.

The EVS 1000 can quickly convert waste dross into pure solder in minutes not hours, while improving the wave solder machine process. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders.

The EVS 1000 is aimed at small to medium users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. This group currently comprises the majority of users in the industry. By using the EVS, nitrogen can be dramatically reduced or eliminated, resulting in significant cost savings.

FINETECH - Booth 2715

FINETECH will display two dual-head wire bonders. FINETECH has formed a new technical partnership with Technical Product Trade (TPT) located in Wessling, Germany to offer manual and semiautomatic wire bonders in the North American market.

The bonders are capable of wedge and ball bonding in one machine, simply by changing the bond tool and selecting the appropriate mode via software. Conversion between ball and wedge bonding takes less than three minutes.  These bench-top systems are ideal for small production, prototyping and R&D environments.  

The HB16 Wire Bonder is an advanced, semiautomatic wire bonder with motorized Y & Z travel that provides controllable loop shape with high repeatability. The system features manual, step and semi-automatic bonding modes as well as stitch bonding and bump bonding. The ball bonding mode handles 17 to 50 um wire diameters and the wedge bonding mode handles from 17 to 75 um wire and 25 x 250 µm Au ribbon.

The HB05 Wire Bonder is a flexible, manual wire bonder.  This system features bump bonding from 17 to 50 um wire and 25 x 200 um ribbon. Additionally, it offers independent control of first and second bond parameters.

Both models offer deep-access bonding (16 mm) using a long-reach transducer, with the wire clamp positioned above the bonding tool. 

Fuji America Corporation - Booth 1537

The concept of Fuji's new XPF is to dramatically improve line production through the use of dynamic head exchange and borderless optimization.

It is now possible to exchange the Single Nozzle Tool of multipurpose machines, the Revolver Tool of chip shooters and the Dispenser Tool of adhesive or flux machines. This exchange can be performed during operation, at high speed, to match the requirements of the production program. The function is known as "Dynamic Head Exchange".

Dynamic Head Exchange offers the tremendous benefit of "Borderless Optimization", which is not possible with standard pick-and-place machines. To summarize the merits when using dynamic head exchange, line efficiency can be improved by fifteen to thirty percent. This improved efficiency is obtained because borders between machine types are completely eliminated.

In addition, the XPF uses Fuji Intelligent Feeders. These feeders have smart functions, including automatic feeder ID recognition and support automatic set-up verification. They also support splicing operations, feeders can be removed and replaced during machine operation and one feeder supports both paper and plastic taping formats of any pitch.

GOEPEL electronic - Booth 1565

GOEPEL electronic will present new innovations for its Extended JTAG/Boundary Scan solutions based on its unrivalled hardware architecture SCANFLEX®, introduced in early 2005.

In particular, the revolutionary innovation VarioCoreâ„¢, a technology for the flexible configuration of I/O modules, will change the Boundary Scan world decisively. VarioCoreâ„¢ allows the dynamic reconfiguration of SCANFLEX I/O modules with special Intellectual Property (IP) in order to support a wide range of test capabilities in the same hardware set-up.

Exhibiting in the booth of its North American distributor Huntron Instruments, Inc., GOEPEL electronic will show a live demonstration involving different IP's for static and dynamic testing, loaded into the I/O module at run-time time to support particular test steps.

GOEPEL electronic is positioning itself as the leading supplier of intelligent solutions for Extended JTAG/Boundary Scan. In addition to latest Boundary Scan hardware and software equipment, the company will present solutions for IEEE standards such as IEEE 1149.1, 1149.4, 1149.6, and 1532. 
 

Henkel - Booth 2001

Henkel will debut several new products and displays its field-proven materials solutions. The materials leader's complete product offerings for the entire semiconductor packaging and PCB assembly value chains will be on display at the event, and Henkel experts will be on-hand to discuss the company's latest research and most innovative new material offerings.

Henkel's Multicore® brand of solder products will be one of the main highlights of the exhibit, with lead-free and mixed-metal-optimized solder products along with the company's award-winning flux solutions on display.

Throughout the 3-day event, Henkel will also show its latest underfill solution: Loctite® 3536.  Developed specifically for use with today's advanced CSP and BGA packages, Loctite 3536 delivers unmatched joint protection and enables long-term performance for modern handheld devices.

In addition to Henkel's award-winning PCB assembly materials, solutions for advanced packaging manufacture will also be showcased at the APEX event.  Semiconductor packaging materials have long been a hallmark of Henkel's complete materials portfolio, with solutions for die attach, wafer-level underfills and mold compounds continuing to break new ground and provide cost-effective, single-source solutions for today's packaging specialists.

Inovaxe - Booth 1672

Inovaxe will highlight its INOCART Material Handling System and INOKIT Software. These products are designed to drastically improve inventory accuracy and reduce material handling labor cost.

Inovaxe develops unique and innovative solutions for supply chain management and inventory control issues. Inovaxe solutions combine state-of-the-art material handling systems with simple to use, but powerful, software applications. The supply chain management software increases visibility, presents actionable data, minimizes inventory liabilities and reduces cost at every step in the process.

INOCART, combined with INOKIT software, revolutionizes the process of kitting and reloading SMT lines. INOCART is a custom configurable material handling solution that allows numerous package types to be stored in a secure, controlled manner, whether that be reels, tubes, feeders or PCBs. The cart and software combine to result in increased inventory accuracy and a quick return on investment.

INOKIT is a complete solution that combines powerful software with innovative material handling equipment to result in a definitive SMT line solution. INOCART allows material to be received directly from the dock to stock/kits, eliminating non-value-added labor and the efforts of moving/transacting material into another stockroom after receipt.

JNJ Industries - Booth 2824

JNJ Industries announces the introduction of Lead-Free Solder Paste Remover, a product specifically designed to tackle the job. The new product is a proprietary blend of aliphatic glycol ethers, isopropyl alcohol and DI Water.

JNJ's Lead-Free Solder Paste Remover is completely RoHS compliant, and can actually be used with any type of solder paste, lead-bearing or lead-free, no-clean and/or water-based. It can be used to clean stencils, screens, misprinted boards, tools, benches, and machinery. It can also be used to clean or remove (uncured) SMT chip bonder type epoxies.

JNJ offers Lead-Free Solder Paste Remover in saturated wipes, 1-pint trigger sprays, gallons, and 55-gallon drums. For more information, visit www.jnj-industries.com

Juki Automation Systems - Booth 2437

Juki Corporation will highlight the KE-2060RL High-speed Fine-pitch Assembler with IFS-X2.

KE-2060RL High-speed Fine-pitch Assembler is for reliable measurement of fine-pitch components. In order to measure both standard and delicate components, Juki has developed an extensive and extremely versatile lighting system (FlexLighting). The system uses three different illumination angles and colors. Optimum illumination is stored in the software database for all standard components.

The KE-2060RL also has a quadruple placement head with multi-nozzle laser alignment and multi-nozzle vision centering (optional MNVC), and can place 12,500 cph (IPC 9850) and 3,400 cph fine-pitch (with MNVC).

The KE-2060RL offers users numerous options, including a height measurement system (HMS) that automatically measures the component height in the tape or stick at the pick position and saves the data in the placement program; component verification (CVS) that checks correct polarity for resistors, capacitors and 2-pin diodes and verifies these electrically; special nozzles; a rear operation unit; feeder position indicator (FPI); flex calibration system (FCS) that allows an automatic measurement of the machine and documents the accuracy of the system with the possibility to correct any deviations; and an auto-width conveyor (AWC) option that automatically adjusts the width of the PWB conveyor when a production file is opened.

In addition to the above options, KE-2060RL offers the following extra options: 3-D coplanarity check for all QFP leads and BGA balls as well as a high-resolution camera for vision centering of 0.3 mm pitch QFPs, CSPs, microBGAs and very small components.

Kester - Booth 1542

Kester will provide lead-free resources, technologies and products on its booth.

Kester will be featuring numerous products from its Lead-Free Solutions (products and services) portfolio to help companies in the transition to lead-free. Among products being featured will be low-cost Ultrapure K100LD lead-free bar solder alloy and its low-cost Ultrapure K100 lead-free bar solder alloy, along with Kester's technical services to help manufacturers assemble lead-free. 

K100LD is a patent-pending, low-cost alternative to traditional lead-free alloys. The bar solder offers the lowest copper dissolution of any lead-free bar on the market, even amongst all common alloys, including Sn63, SAC305 and other lead-free options.

K100LD represents an improvement over competitive alloys, including other variations of Tin-Copper-Nickel (SnCuNi).

Besides offering the lowest dissolution of copper from boards and components of any lead-free alloy, K100LD offers numerous benefits, including anti-drossing technology, bright, smooth solder joints with no visible shrinkage effects, excellent through-hole penetration and topside fillet with virtually no bridging, and reduced leaching of solder pot materials.

Additionally, K100LD is compatible with all types of board and component metallizations, is compatible with other SnCuNi alloys, and its lead level is specified at less than 0.05 percent, ensuring RoHS compliance.

KIC - Booth 1528

KIC will introduce KIC Vision, an Automatic Profiling System.

This low-cost system is designed for those customers that want to eliminate the manual tasks associated with periodic profiling for their reflow ovens.

Priced comparative to a manual profiler, the easy-to-use KIC Vision provides the best of both worlds - It runs in the background continuously and automatically, and it provides sought-after profiles as frequently as once an hour.  The system relies on embedded sensors in the reflow oven and the proven Virtual Profiling software to accurately measure the product profile.

After a baseline profile, the product profile is automatically measured and logged in the computer without any further manual input.  The measured profile data includes all pertinent process data such as peak temperature, soak, fit to process window and more.  The user may select the frequency of the automatic profiling from one profile in per hour increments up to once a week time slots, in one-hour intervals.  KIC Vision reduces production downtime, recovers labor time resources and significantly improves product quality.

The extremely cost-effect KIC Vision now makes automatic profiling accessible to most electronics manufacturers large and small.  It is time to put Vision into the reflow oven.

Kyzen Corp. - Booth 1401

Kyzen Corporation, will introduce AQUANOX A4625B, a MEA-free aqueous blend specifically designed for optimum effectiveness in batch washers. This easy-to-use cleaning material will remove flux residues and contaminants associated with most electronics assembly processes while being environmentally friendly.

A4625B is used at low concentrations for optimum cleaning efficiency without damaging delicate substrates.

Milara - Booth 1971

Milara Inc., will showcase the new SemiTouch Auto Vision alignment batch stencil printer (STAV).

SemiTouch Auto Vision alignment stencil printer (STAV) is a semi-automatic stencil/screen printer with full auto vision alignment. Currently, the system is targeted to the SMT industry with semiconductor applications scheduled for the near future.

The STAV printer features a maximum print area of 16 x 20", stencil frame size up to 29 x 29", and board sizes from 2 x 2" to 16 x 23" with servo-controlled, fully programmable X, Y, and Theta automatic vision alignment. The STAV is also equipped with new bottom-side tooling support using Grid-Lok™ or others. With universal Vibraserve® vibration squeegee heads, the printer is a must-have for any company's production line. Additionally, it offers users run-time diagnostics, message feedback and advanced safety features.

Options available for STAV include closed-loop squeegee pressure control, new ultrasonic bottom-side stencil wiping system, and choice of Grid-Lokâ„¢, Red E Set or other support tooling technologies that can be requested by clients.

OK International - Booth 2201

OK International will introduce a precision rework solution for advanced packages and assemblies at APEX 2007.

Thermal Tweezers Nozzles will reduce thermal stresses placed on PCBs during multiple rework operations for POP Package on package stacked device components, and will deliver significantly better performance than traditional hot air tools and vacuum cups that are not suited for use with multiple stacked components, glob-top encapsulated die, or small devices that are easily damaged by excessive temperature.

Using Thermal Tweezers Nozzles, engineers will be able to successfully remove devices such as multiple vertically-stacked ICs without damaging the IC packages and without exposing the PCB to excessive reflow cycles over and above the IPC-recommended maximum of five cycles. This maximum can easily be exceeded after initial assembly, subsequent removal of two or even three vertically-stacked components using conventional rework tools, and final reassembly.

Thermal Tweezers Nozzles allow heat to be confined to the localized area of the stacked solder joints, thereby preventing the total PCB from reaching reflow temperatures.

Thermal Tweezers Nozzles are designed for use in combination with the heating nozzle of a rework station such as the OKi APR-5000 Array Package Rework System.

Practical Components - Booth 2565

Practical Components Inc., will have a range of products and resources available at the APEX 2007 trade show and exhibition.

With the worldwide migration to lead-free processes, new alloys and materials evaluations, inspection changes, tin whiskers, reliability, and increased assembly costs, Practical Components continues to supply cost-effective dummy components in cutting edge new packages as well as the industry standards.
 
On display include exciting new products such as Amkor Technology's breakthrough PoP (package on package stacked daisychain), the PC200 PoP test board and kit, the Dual Row MLF® from Amkor Technology, and the PC2006 AIM print test board and kit.
 
In addition to showing mechanical samples for Amkor Technology and components from most other leading SMD manufacturers including FlipChip International, Practical Dummy Components will be displaying solder training kits and PCB training and test boards.
 

PROMATION - Booth 1407

PROMATION Inc will highlight the latest Post -AOI sorting workstation after a YESTECH AOI machine.

ENG-700F is an in-line workstation (1000 mm long) that looks like a standard inspection station with overhead lighting, rear adjustable part tray, ESD semicircle front work surface and Audit/Pass selection, but has added features.

ENG-700F is used for inspection and touch up of suspect PCBs after AOI inspection.

In addition, it is running special promotional prices for APEX on its ASC-700 transfer conveyors from now until the end of February 2007.

The ASC-700 transfer conveyors are available in 500 and 1000 mm lengths and have been designed to meet most interconnecting requirements. Equipped with a retractable hand crank for width adjustment, the station is capable of handling PCBs ranging in width from 50 mm (2") up to 460 mm (18.1").

A logic controller provides reliable end-to-end transfer using standard SMEMA (1.2) communication protocol. This sleek design also includes PROMATION's "Easy Roll" wheels with leveling feet (making installation a breeze) and a complete wrap around enclosure that protects the PCB during transfer.

RMD Instruments - Booth 1052

RMD Instruments LLC will premier the LeadTracer-RoHS XRF system.

The LeadTracer-RoHS XRF system is a major innovation and advancement of the XRF analysis technology.  The LeadTracer-RoHS is the only XRF system that is designed specifically for the electronic industry to provide fast, accurate, and portable screening capability to meet RoHS directives.

This XRF system's unique approach to analyze the entire body of the components rather than performing just a surface analysis, in a short period of time, speeds up the RoHS screening requirements and improves the overall throughput of the QC process

LeadTracer-RoHS' ability to analyze the entire energy spectrum eliminates the possibility of false-negative indications in components that otherwise would have found their way into the manufacturing process.  The use of non-compatible components such as those containing lead in a lead-free process will result in contamination of the solder pot, which is costly and environmentally undesirable. Elimination of non-compatible components from the process saves time, money, and leads to improvement of the line output.  Additionally, the consistent flow of parts will reduce the maintenance and repair of the machinery used in electronics assembly.
 
The ease of use of LeadTracer-RoHS XRF system is based on its ergonomic design, and features such as laser-guided sample indicator, bar-code reader, spectrum display, BlueTooth connectivity, heads-up display, and patented applied for adjustable apertures that provide the most user-friendly platform for implementation of the screening process.

Tamura - Booth 1145

Tamura H.A. Machinery Inc., will exhibit TNX30-537PM reflow soldering system.

TNX30-537PM is a compact, next-generation high-performance N2 reflow system with seven heating zones. The system features automatic adjustment of preheating and soldering temperatures of the PCB, excellent heating performance with the application of a high circulating hot-air heating system, and enhanced uniformity in blow-off air temperature. 

Standard features of the TNX30-537PM include an O2 densitometer, activated carbon reproduction unit, temperature profile indication, catalyst function, UPS for PC protection and a flux collection unit. Additionally, the system is available in multi-language versions (Japanese, English and Chinese).

Numerous options also are available, including a water-cooling unit, automatic width control, O2 concentration controller, backup battery system, warp prevention unit and area sensor.

TMT-TECLAM - Booth 660

TMT-TECLAM a jont venture of TMT Trading GmbH and TECLAM Industries with subsidaries in Kirchheimbolanden/Germany, Bangalore/India and San Francisco/United States has been established in the recent months.

The group of companies will sell consumables to PCB manufacturers all over the world. TMT-TECLAM´s Directors and Owners,  Andy Jabbar and Thomas S. Michels have decided to join forces after a number of requests from global PCB manufacturers for services and supplies to all their plants across the world.

The first step was the ramp up of cutting facilities in Bangalore India and Kirchheimbolanden/Germany in order to fulfill customer requirements.

The new group concentrates on the sale of Back up,  entry materials and high end drills/routers for PCB drilling including a resharpening service for used drills with a monthly capacity of 250.000 drills/month.

VJ Electronix - booth 2637

VJ Electronix, a leader in X-Ray inspection technology and Rework systems, will introduce Vertex Series-A X-Ray Inspection System.

To meet significant industry challenges, the X-Ray Inspection System offers numerous features to help customers to inspect PCB and component assemblies quickly and accurately. A new Flexible Design allows it to be customized to any Inspection Task.

The Vertex Series-A allows for faster load/unload product exchange; reproducible results based on repeatability of closed-loop control system.

The Vertex Series-A offers an inspectable area of 20 x 24" (508 x 610 mm) to entirely cover PCBs up to 20 x 24". The large board-handling table and large inspection area are especially important to suit server boards and other large assemblies. Its modular configuration allows customers to select multiple choices of tube, detector and motion components as well as Software Options to optimize the system for any application.

VJ Electronix will also display Summit 2200 Advanced Rework Station.

Summit 2200 is engineered for the most demanding lead-free processes. Using many of the award winning and proven Summit 1800 components and processes, the 2200's advanced features include:

New Automated Site Prep (scavenging) System - This system allows fully automatic, component removal, non-contact, site prep, and placement of components with minimum operator intervention, thus reducing the operator variability of a manual system and resulting in fewer scrap boards.

Automatic and Vision Assisted Placement - The automatic placement system facilitates precision placement of high lead count components, such as Cu-CGAs.

Wide Area Profile Storage Compatibility - Using advanced network software, the Summit 2200 allows for central storage of processes and profiles.

New Bottom Heater and Motorized Table - The Summit 2200 incorporates a 4.0 kW or a new 5.6 kW bottom heater designed for lead-free processes.

New Integrated Technical Documentation - All manuals, help files, schematics and knowledgebase troubleshooting are imbedded in the SierraMate 7.0 application software.

X-Tek - Booth 2237

The X-Tek Group, one of the world's leading manufacturers of real-time microfocus X-ray systems, will announce the inclusion of a new camera and detector combination for the Revolution NanoTech X-ray inspection system and a new validation station for enhanced production capability at APEX.

Visitors to the X-Tek booth will also be able to experience a demonstration of Computerized Tomography (C.T.), a powerful new 3D imaging capability to the industry leading Revolution system.

Impix, the new scientific grade camera and detector combination, further improves the dynamic range, accuracy, repeatability and feature recognition capability of the Revolution. The camera boasts real-time frame rates at full camera resolution and full dynamic range.

X-Tek pioneered a powerful new X-ray source which allowed an international team of researchers to reveal the true purpose of one of the most technically advanced artefacts from the Greek Classical world, the Antikythera Mechanism.  X-Tek specifically developed a new 450kV microfocus X-ray source for the project, a dramatic advancement over the conventional 225kV source. The results from X-Tek's new C.T. system provided researchers with new material and enabled them to read inscriptions that had never been seen before.