Lloyd Doyle to participate in EIPC Winter Conference 2007
Jan 24, 2007
Lloyd Doyle Ltd., supplier of automatic optical test (AOT) and inspection systems for bare printed circuit boards, announces that it will participate in the European Institute of Printed Circuits (EIPC) PCB Technologies Cost and Innovation EIPC Winter Conference 2007 and Tabletop Exhibition, scheduled to take place February 8-9, 2007, in Salzburg, Austria.
Lloyd Doyle will have a tabletop presentation during the conference with experts available to discuss the company's new, advanced technologies.
The conference programme, "Success through Market and Technology Know How," will take place on February 8 from 8:15 a.m. - 5:30 p.m. and will include the following topics: management and environment, surface treatment and advanced plating technology, advanced developments in laminate and prepegs, and imaging of conductor lines and solder mask. Panel discussions will follow each session. On February 9, the conference will take place from 8:30 a.m. - 1:30 p.m. and will cover advanced technology, and soldermask technology including RoHS and WEEE needs. Again, panel discussions will follow each topic. A networking lunch will end the conference.
For more information on EIPC's Winter Conference, visit www.eipc.org