Free forums at APEX

Join industry experts and peers as they discuss cutting-edge and high priority solutions and challenges in these interactive sessions. Get the latest on technology and trends at these FREE sessions.
 

F01 iNEMI: Optimizing Lead Free Processes
Tuesday, 2/20/2007  1:30 PM - 3:00 PM 

David Godlewski, iNEMI; Denis Barbini, Vitronics Soltec; Jasbir Bath, Solectron Corporation; Richard Coyle, Lucent Technologies, Inc.; Robert Kinyanjui, Sanmina-SCI Corp 

The electronics industry has been preparing to go lead free for several years, but the transition to lead free manufacturing is really just beginning. Much work remains to be done to optimize the conversion from eutectic solder and to achieve the same knowledge we have with tin lead processes. This free forum will review some of iNEMI's lead free projects that focus on lead free processes in areas such as wave soldering, rework, mixed soldering and surface finishes.
 

F02 Technology Roadmapping - A Look Toward the Future
Tuesday, 2/20/2007  3:15 PM - 4:45 PM 
 
John Fisher, Interconnect Technology Analysis, Inc.; Dieter Bergman, IPC; Greg Munie, Ph.D., Kester Northrop Grumman; Dennis Fritz, MacDermid, Inc. 
 
Here is a tremendous opportunity for all attendees to learn about the new IPC International Technology Roadmap for 2006/2007. Presentations will highlight the various concepts used for developing the new roadmap and how it mirrors other roadmaps for the semiconductor industry and the OEM customer. We will discuss the paradigm shifts necessary to meet the new criteria for higher bandwidth and restrictive substance regulations. In addition, miniaturization will be a top issue as one of the major performance criteria.
 

F03 The Total Packaging Solution under Jisso
Wednesday, 2/21/2007  9:00 AM - 10:00 AM 
 
Joe Fjelstad, Silicon Pipe, Inc.; Richard Otte, PROMEX Industries, Inc.; Edmund Blackshear, IBM Corporation; Dennis Fritz, MacDermid, Inc. 
 
This session will address the topic of Jisso, a Japanese word that represents the total packaging solution for new product development and introduction. The process starts with the original design and incorporates decisions for electronic elements, electronic packaging and modules before moving to the final product and system. The Jisso North America Council (JNAC) is a feeder to the international group, which is composed of delegates from Europe and Asia. The presentations will show the data flow between the various experts as they establish new processes, new standards, and methodology to meet the challenges of the future.
 

F04 Supply Chain Management (SCM): Systems and Technologies
Wednesday, 2/21/2007  10:15 AM - 11:45 AM 
 
Henry Co, California State Polytechnic University; Rod Winger, Epicor Software Corporation; Vijay Deokar, California State Polytechnic University; N.T. 'Bala' Balakrishnan, California State University 
 
Successful Supply Chain Management (SCM) implementation requires state-of-the-art systems and technologies to integrate information and product flows between suppliers and manufacturers. This session describes a successful SCM implementation for a medium-size manufacturing company, quality control issues in supply chains and the deployment of Radio Frequency Identification (RFID) and Voice over Internet Protocol (VoIP) technologies to leverage the power of SCM.
 

F05 Asian Developed and Implemented Technologies and Business Practices You May Have Missed: Equipment, Materials, and Manufacturing Processes
Wednesday, 2/21/2007  1:30 PM - 3:30 PM 
 
Erik Walker, ORC Imaging Corporation; Gene Weiner, Weiner & Associates, Inc.; Hamed El-Abd, WKK Distribution Ltd.; J. Stan Erickson, E. I. DuPont de Nemours and Co; Henry Utsunomiya, Interconnection Technologies, Inc. 
 
A diverse group of successful senior executives will present business practices, technologies, production, asset shifts, packaging, equipment, materials, assembly and fabrication in a program that covers Japan, China and the rest of Asia in a way never before made available in the U.S. Managers and decision makers in virtually every phase of the interconnect industry will benefit from attending this well-organized session.
 

F06 Advanced Technology Strategy Roundtable
Thursday, 2/22/2007  9:00 AM - 11:45 AM 
 
Joe Fjelstad, Silicon Pipe, Inc.; John Fisher, Interconnect Technology Analysis, Inc.; Dieter Bergman, IPC; Richard Otte, PROMEX Industries, Inc.; Timothy Estes, Conductor Analysis Technologies, Inc. 
 
In this interactive roundtable, we will discuss future ideas and methods being proposed by various suppliers and technologists to design, fabricate, assemble, and test the products of the future. How will your company position itself in the future? The panel of experts will generate intriguing ideas for determining company strategy now and for the long term. Everyone is invited to participate and encouraged to bring your issues for discussion.
 

Rel Sum - Reliability Summit: Keeping Industry Reliability Test Protocols Current with Rapidly Changing Markets
Friday, 2/23/2007  8:00 AM - 5:00 PM 
  
It's an understatement to say that reliability testing has become a challenge for our industry. New technologies and new markets lead to new requirements for testing. Standards cannot keep up with the pace of change. And yet, reliability testing is more crucial today than ever before. Attend this free one-day session to discuss current industry initiatives and make plans for a path forward. This session is sponsored by IPC and iNEMI in cooperation with GEIA, HDPUG and JEDEC. Please register in advance to allow proper arrangements to be made.
 
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