Teradyne sponsors 2006 FSA awards dinner celebration

Event recognizes excellence in the semiconductor industry

Teradyne, Inc. (NYSE: TER) announces its sponsorship of the 2006 FSA Awards Dinner Celebration to be held on Thursday, December 7, 2006 at the Santa Clara Convention Center in Santa Clara, California. Teradyne, which currently has over 2,300 test systems installed at semiconductor subcontractors throughout the world, is sponsoring this annual event that recognizes fabless companies who have demonstrated excellence through their success, vision, strategy and future opportunity in the semiconductor industry.
 
"Teradyne has been an active member of FSA since 1995," said Vivian Pangburn, vice president, global marketing and membership at FSA. "Test solutions continue to be an area of vital importance to fabless companies. As a major provider in the subcontractor supply chain, we appreciate Teradyne's involvement in FSA and their support of the Awards Dinner Celebration, which recognizes excellence in the semiconductor industry."

"FSA plays an important role in keeping members connected to the latest technologies and trends in the fabless semiconductor community," said Mark Jagiela, President, Semiconductor Test Division, Teradyne. "Teradyne serves countless IDMs, fabless and subcontract manufacturers. Our FLEX(TM) Platform is designed to meet the integrated technologies, multisite economics and accelerated time-to-market demanded by the fabless industry. As a market leader in providing test solutions to fabless and subcon companies, Teradyne is pleased to continue our support of FSA and sponsor the 2006 FSA Awards Dinner Celebration."

The FLEX Test Platform offers a broad range of single board, high-performance, high-density analog (AC and DC) and digital instruments that replicate the device operating environment for test. The range of instrumentation lets users apply the best test strategy for high performance digital or high precision analog at package or probe.