BI Technologies develops non-moulded 75w power resistor
Nov 15, 2006
Providing design engineers with an open screened substrate device for applications requiring superior thermal performance, TT electronics BI Technologies SMT Division has developed a non-moulded power resistor rated up to 75W.
Designated the BHP75 Series, the resistor is housed in a TO-220 opened screened substrate package, and features an insulated tapered venturi bonded to the substrate for maximum heat dissipation.
According to Jim Rieley, Sales Director for BI Technologies' SMT Division, the design of the BHP75 Series resistor allows for three methods of heat dissipation, resulting in exceptional power handling characteristics. "The chimney-shaped tapered venturi is attached to the ceramic substrate and convection forces hot air up the "neck" of the chimney and away from the resistor face of the component," Rieley said. "The power resistor utilizes all three methods of heat dissipation, including conduction through the heat sink tab, radiation from the resistor surface, and convection through the venturi element."
Typical applications for the BHP75 resistor include higher wattage switchmode power supply circuits, motor control and drive circuits, inverters and industrial power equipment.
For more information, visit http://www.bitechnologies.com/products/passive.htm.