Indium Corporation announces new Product Manager
Nov 22, 2006
Indium Corporation announced the addition of Andy Mackie as Product Manager for Semiconductor Packaging Materials. Andy is based at Indium's Global Headquarters in Clinton, NY, and reports to the Director of Solder Products.
Andy is responsible for the global marketing efforts for all of Indium's Semiconductor Packaging Materials, including solder spheres, ball attach fluxes, wafer bumping fluxes and pastes, and epoxy fluxes.
Andy has over 17 years of experience in new product development, sales, and marketing of electronics assembly and semiconductor packaging. He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly. He received the IPC President's Award in 2001 for his leadership in IPC's Solder Paste Task Force and the Assembly and Joining Materials Subcommittee.
For more information about Indium Corporation visit www.indium.com