More Global Technology Award Winners
Sep 29, 2006
The awards were presented during a Wednesday, September 27, 2006 ceremony that took place at the Sofitel Hotel during the Assembly Technology Exposition.
See also 'Aqueous, Kyzen and Transition Automation all win Global Technology Awardâ€™ at http://www.emsnow.com/npps/story.cfm?id=22134
In the category of Inspection Equipment AOI for its Flex Ultra automated optical inspection system (AOI).
The Flex Ultra AOI system is an automated inspection solution for all stages of the SMT production process. Combining CyberOpticsâ€™ patented Statistical Appearance Modeling (SAM(TM)) technology with a simple user-interface, the Flex Ultra has a single programming paradigm that enables fast programming of AOI inspection tasks and the industryâ€™s lowest false call rate. Flex Ultra also features highly accurate and repeatable component offset measurement capabilities for process characterization and optimization.
The AOI system features high-speed, pre- and post-reflow inspection capabilities, easy programming, and the ability to inspect any component or feature - including lead-free assemblies. It also has a simple, scalable mechanical architecture - available in 8" (200 mm), 12" (300 mm) and 18" (450 mm) configurations to fit the assembly lineâ€™s need and budget.
New features on the Flex Ultra include updated platform with enhanced resolution and faster inspection speeds, technology-leading 01005 measurement capability (component offset measurement Gage R&R <10 percent), program call-up using bar code reader, and an XML file format output for easy integration to shop floor control systems.
In the category of Assembly Tools for its innovative Solder Ball Feeders.
Europlacerâ€™s new solder ball feeders provide a low-cost solution for solder ball assembly. By using exclusively licensed patent-protected techniques, the innovative feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process. The feeders have been designed to fit as standard on all Europlacer pick-and-place machines so that ball assembly can be seamlessly integrated into existing surface mount lines, presenting significant cost benefits to users.
This solution allows spheres to be placed with standard pick-and-place equipment simply by using a specific feeder and a specific nozzle. Additionally, the machine can simultaneously place standard SMD components, increasing both speed and throughput rates.
SMD designers and manufacturers have the capability to use spheres with all the corresponding advantages. This opens new possibilities in terms of design, including higher density, lower cost, smaller electronic modules, use of solder balls for daughter board interconnection or for shielding and more. The possibility exists to utilize the process for BGA manufacture where a matrix of balls could be combined with additional chip devices in a single assembly process.
Europlacer then incorporated the technology into the design of two types of solder ball feeders (rotary and linear), providing a low-cost solution for solder ball assembly.
The Europlacer solder ball feeder (and resultant assembly process) has been developed with Novatec SA and offers numerous features and benefits including automatic assembly of solder balls with very high first pass yield, easy load intelligent feeders and nozzles for single or multiple ball assembly, and extremely fast product changeover. Furthermore, the feeder designs enable quick and simple replenishment of the solder ball reservoir, while placement of PCBs or other mediums on pallets are possible.
In the category of Device Programming for its innovative Helix Programming System.
With the introduction of the Helix programming system, device-programming customers can receive the quality of automated device handling at a lower price point than traditionally available. Helix offers users significant cost benefits. The capability to have the quality of automated device handling at a more affordable price is extremely beneficial.
The Helix provides the quality of automated device handling less expensively because it comes with two precision-designed tube input and output handling systems or a tray input and output handling system as well as up to eight sockets for device programming. The operational sequence of the machine is to pick the part from the tube or tray, transfer to the programming socket, program the part and return to the programmed tube or tray. The precision tooling head requires no vision system for handling fine-pitched parts and features an overall throughput of 800 devices per hour, providing increased speed and throughput rates.
At the heart of this automated programming system are two BPM Microsystems Enhanced 7th generation sites with FX4 socket capability. Easy to use and implement, the integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. One computer and software interface controls both BPWin software and handles control operations.
Helix allows manufacturing centers around the world the capability to benefit from less bent leads or damaged parts that occur with the manual handling of programmable devices.
In the category of Environmentally Friendly Products/Services for its innovative UltraPureÂ® K100LD, a lead-free bar solder alloy for the electronics industry.
K100LD is a patent-pending, low-cost alternative to traditional lead-free alloys. The bar solder offers the lowest copper dissolution of any lead-free bar on the market, even amongst all common alloys, including Sn63, SAC305 and other lead-free options.
K100LD represents an improvement over competitive alloys, including other variations of Tin-Copper-Nickel (SnCuNi). K100LD is a low-cost (silver-free) lead-free alloy primarily containing tin and copper with the inclusion of metallic dopants to control the grain structure and the Copper dissolution rate. K100LD has a slower rate of Copper dissolution than competitive SnCuNi alloys, which minimizes pot maintenance, maintains consistent soldering performance and improves reliability.
K100LD is a Silver-free alloy, resulting in much lower costs than traditional lead-free alloys, such as SAC305. Kester K100LD provides the lowest delivered price to the global wave soldering market. K100LD includes anti-drossing technology, an important attribute with lead-free soldering that also represents additional cost savings to the assembler.
Besides offering the lowest dissolution of copper from boards and components of any lead-free alloy, K100LD offers numerous benefits, including bright, smooth solder joints with no visible shrinkage effects, excellent through-hole penetration and topside fillet with virtually no bridging, and reduced leaching of solder pot materials. Additionally, K100LD is compatible with all types of board and component metallizations, is compatible with other SnCuNi alloys, and its lead level is specified at less than 0.05 percent, ensuring RoHS compliance.
In the category of Printing Equipment for its Icon i8 Fully Automatic Screen Printer.
The Icon i8 represents something of an industry first. Setting the benchmark for assemblers seeking the lowest cost of ownership, Icon i8 delivers superior performance and value, coupled with everything else expected from a high level printing platform. Wielding exceptionally high throughput and immense flexibility, Icon i8 has been specifically developed to meet the precise demands of the fast-paced Asian electronics market.
In theory, the performance of Icon i8 is driven by a set of highly impressive technical credentials. In practice, this unique machine takes it one step further. Featuring a high degree of automation to maximize throughput and minimize operator intervention, the Icon i8 reduces product changeover time to a minimal two minutes.
Additionally, the introduction of new boards to the production line is easy, facilitated by a fast new product set-up time of less than 10 minutes. Along with a host of other impressive technical specifications, Icon i8 delivers a rapid 12 seconds cycle time, 350 x 300 mm maximum board dimensions and compatibility with a range of advanced performance options.
In the category of Bonding Equipment for the FINEPLACER Pico AMA Automatic Micro Assembler.
The FINEPLACER Pico AMA offers users extreme flexibility. Because the system is based on a modular platform, it can accommodate a wide range of bonding techniques, including flip chip (thermocompression, ultrasonic and soldering), dispensing, UV curing, fluxing, ACF and ACP. The ability to upgrade and retrofit provides significant cost benefits to users - it provides an "all in one" cost-saving solution.
With a placement accuracy of 5 micron (at 3 sigma), the FINEPLACER Pico AMA is ideal for the advanced placement and bonding of optoelectronic components, MEMS, multi-chip modules, sensors, RFID mounting and more. Picture processing, self-propelled positioning table and placement arm, as well as automatic force generation allow the system to bond numerous, like components continuously. Standard and customer specific tools also are available. These features combine to provide increased overall quality and consistency of performance. The FINEPLACER Pico AMA is operator independent, providing stability and increased process safety for a production environment.
Wong Kong King Technology
In the category of Contract Services for its innovative and comprehensive services to the electronics industry.
Since it was founded in 1986, WKKT has grown to more than $218 million in sales for 2003. The company currently has a staff over 3,800 people worldwide. WKK has been named the 23rd largest Electronic Manufacturing Services (EMS) company worldwide.
WKKT provides full range of comprehensive lifecycle manufacturing services to support the manufacturing of electronics, including to OEMs, ODMs, printed circuit board assemblers and systems assemblers. Because of the comprehensiveness of the services, customers are ensured of high-quality and consistent performance. Also, because an entire portfolio of services is available, customers receive much more their money, making WKKTâ€™s services affordable and cost beneficial.
WKKT uses the latest in high technology placement and test equipment to provide the widest range of electronics manufacturing capabilities. With ongoing expansion plans and investments in state-of-the-art equipment, WKKT is actively keeping ahead of customer demand in order to maintain timely delivery. The company offers experience in a broad range of product types including Computers, Telecommunications, Industrial Products and Consumer Electronics.
In the category of ID Systems for its unique Reel-to-Reel RFID Line.
This line is an industry first - it is an entire assembly system. The system has many features, including throughput up to 9,000 cycles per hour (cph), a full 20" wide Web process capability, and 12 um placement repeatability +/- 3 Sigma.
In addition, user benefits are high - the system offers either passive or active designs, direct die pick from wafers down to 0.008", and positive displacement dispense technology. The Reel-to-Reel RFID System features modular construction, allowing for future capacity expansion. It is fully capable of placing ancillary components such as batteries, and it also is capable of tape-and-reel die placement.
The Tyco Electronics Reel-to-Reel RFID system has met the industry challenge of a flexible and cost-effective system to manufacture RFID tags, while steadfastly focusing on the goals of quality and throughput. The system provides the utmost in flexibility, both in the production mode and the ability to do a changeover. It is designed to require minimal operator intervention, and provide maximum throughput.