EFD Solder Paste Group and Leister Technologies join forces
Aug 11, 2006
Cooperative worldwide marketing effort for advanced tabletop laser soldering reflow system
The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, automated solder paste reflow system designed to substantially increase production yields and deliver greater throughput. Among its many advantages, the times savings alone with the EFD/Leister package could reach 80% or more over traditional wire and iron soldering methods.
This EFD/Leister soldering system is combines EFD's industry-proven auger valve and Ultra® TT tabletop dispensing robot with Leister's renowned Novolasâ„˘ diode laser. Other key system features enhance this advanced solder automation breakthrough, including EFD's unique SolderPlus® solder paste. The solder paste formulations available are fast, clog-free and designed to support the sub-second reflow cycles times common with laser heating.