Dage's David Bernard to present at SMTA International
Aug 16, 2006
Dage Precision Industries is pleased to announce that David Bernard, product manager x-ray systems, will present a technical paper on inspection of popcorned BGA devices at the upcoming SMTA International conference.
Dr. Bernard will present the paper, "Correlating the presence of popcorned BGA devices post reflow with solder-ball diameter measurements from x-ray inspection" on Wednesday, September 27th at 1:30 PM at the Rosemont Convention Center in Rosemont, Illinois. The paper highlights x-ray inspection techniques of popcorned BGAs and the concomitant effects that popcorning has upon product reliability as a result of increased moisture sensitivity levels (MSL) of semiconductor devices during the lead-free reflow process.
Critical issues will be reported including the results of solder-ball diameter x-ray inspection measurements of suspected popcorned lead-free BGAs placed on a variety of board-finishes. The correlation of the measurements to the identification of popcorning in BGAs will be discussed.