Seeba organise lead-free products workshop
by
Dec 05, 2002
IPC and the Die Products Consortium (DPC) have announced their plans to co-sponsor a free online conference on the current state of bare die packaging. The 30-minute presentation will take place Friday, May 16, 2003, at 11:00 a.m., Central Standard Time. The free web conference, entitled "Next Generation Bare Die Packaging," will attempt to explain how advanced packaging approaches can provide leading edge solutions, while still allowing the flexibility to respond to changes in market demand and product differentiation. The presentation will also aim to dispel the myths of known good die (KGD) and identify the tools required to be successful in the world of packaging innovation. Topics covered in this seminar include PCB design, fabrication and assembly to support die products, roadmapping, and standardisation priorities. Source: PCBnewsline
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