Nepcon Shenzhen - exhibitor preview III

In less than a week's time we will meet in Southern China for this year's Nepcon Shenzhen event - here are a few more of the exhibitors that will be taking part.  See also exhibitor preview part one at http://www.emsnow.com/npps/story.cfm?ID=21204 and part two at http://www.emsnow.com/npps/story.cfm?ID=21296

CyberOptics - Booth 2D21

CyberOptics Corporation has announced that it will highlight SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system.

This new generation in-line, 100 percent inspection system takes the SE 300 to the next level. SE 300 Ultra provides accurate, repeatable results at speeds that keep up with increasing line cycle times.  The SE 300 Ultra incorporates the field-proven technology and reliable features of the SE 300 along with new features.

Offering ultra-fast inspection speeds, the system features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options - rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.

Additionally, the SE 300 Ultra provides the ability to handle odd-shaped pads, superior paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. The Ultra also features paste height, area and volume measurements with Gage R&R <10 percent.

During 2006, new features have been added to the inspection system, including technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.

Assembleon - Booth 2E21

Assembleon will be introducing its next generation A-Series Pick & Place solution at Nepcon. Offering optimum line configuration for every application, the next generation A-Series features an integral platform with a modular solution.

Based on a single platform, the three modules in the series (AX-201, AX-301, AX-501) share a common user interface and the same range of feeders, trolleys and placement heads. At Nepcon you can watch a real next generation A-Series production line in action - an AX-201 module working seamlessly with an AX-501 module.

The AX-201 module handles odd-form ICs and all types of fine-pitch components - including ceramic BGAs and high-reflection connectors. Placing up to 11,000 components/hour (to IPC9850), the AX-201 is accurate to 20um @ CpK>1.0 and achieves single-digit Defects Per Million (DPM).

Both odd-form and through-hole components, up to 165mm long and 40mm high, can be placed using the exact force required, from 0.9N to above 40N for difficult, snap-in parts.

Placing from 34,000 to 110,000 components/hour (to IPC9850), the AX-501 module enables output to be scaled up or down. Even with such high placement rates, accuracy is an excellent 40um @ CpK>1.0. The equipment places components varying from 01005 types, right up to those measuring 45mm square.

www.assembleon.com

Seica - Booth 2H50

Automotive Issues - Although exempt from the EU RoHS Directive, and therefore avoiding the turmoil that most of the electronics industry is in, manufacturers of automotive electronics face many challenges over the next few years. One of these is the potential for leaded components to become obsolete or too expensive as a result of the lead-free ban, therefore forcing automotive manufacturers to bring forward their own lead-free trials. This may have consequences on the reliability of the assemblies that have been processed at greater temperatures. The perennial pressure on these manufacturers is to produce the safest, most reliable equipment - a pressure that is multiplied by the huge variety of regional regulations. And yet automotive manufacturers face the same downward pressure on cost and upward pressure on functionality as everyone else in the electronics industry. Never before has it been so important for these companies to ensure that a test regime is in place that ensures the integrity of both their processes and their end products.

Amongst other systems Seica SpA will showcase at Nepcon Shenzhen the following new systems, all equipped with the innovative VIVA software with special features, designed especially for the automotive industry:

Strategy VL- Seica's Innovative New Functional Test System
The Strategy VL, in the various different configurations (which can be "customized" to satisfy specific user requirements), can perform low value analog measurements, power analog, low frequency and high frequency digital measurements. Moreover, the system offers the possibility to integrate a wide range of external instrumentation managed by one, easy-to-use and intuitive software environment. This feature makes for a virtually unlimited range of applications, while maintaining the advantages of a test system based on a clearly defined internal architecture, and the switching matrix of the instruments completely integrated in the basic configuration.

The Strategy VL platform is suitable to test both new products and for the repair of boards and/or assemblies from the field, thanks to the powerful fault finder tools included in the software. Its high level of configurability, in terms of instrumentation and performance, makes the Strategy VL system an ideal fit for all automotive users due to the outstanding performance, herewith:

-- One system is able to test ALL products mounted inside the vehicle
-- New boards have been developed by Seica specially dedicated for automotive testing  (programmable loads, active loads to test those products)
-- The system itself can integrate off-the-shelf instrumentations (scope, spectrum-analyzer, signal generator)

Pilot VIP Flying Probe System
Seica will also showcase it's innovative PILOT VIP Flying Probe system, a full-performance test system that integrates a complete set of test tools and techniques that go beyond the conventional definition of "flying prober". It is another product in Seica's portfolio of automated test solutions, and includes a SMEMA conveyor, which is completely user-programmable to suit various manufacturing and test process layouts.

Firefly Selective Soldering System
Seica will also present Firefly, another automated product designed to meet the increasing need for automatic selective soldering, using the power of laser technology. Firefly is also based on Seica's VIVA Integrated Platform, offering all of the advantages of the simple, three step process for generating, verifying and running a soldering program. It also has additional software tools that can be used to further optimize system flexibility and performance. The integrated temperature control system provides continuous feedback during the soldering process, with real-time, on-screen display of the thermal profiles. Firefly is equipped with a SMEMA board conveyor system for easy integration into any production line.