Pb-free compatible die attach adhesive now available from Henkel
Jul 18, 2006
Henkel has once again developed a superior packaging material to meet the emerging requirements of leading semiconductor firms.
Developed specifically for stacked die applications that require extremely low stress and robust mechanical properties, the electronics group of Henkel has introduced Hysol® QMI536NB. Unlike other die attach materials used for stacked die manufacture, Hysol QMI536NB can be used on all levels of a stacked die, enabling packaging specialists to qualify a single material. This one-material capability provides significant supply chain efficiency and reduces overall manufacturing costs.
"Daughter die generally need a filler that won't damage the die passivation of the mother die, but use of these fillers often tends to increase resin bleed," comments Michael Buckley, Henkel Global Product Manager for Die Attach Materials. "Hysol QMI536NB eliminates these issues, delivering very low bleed and allowing use of a single material for all layers of a stacked die."
Hysol QMI536NB is a non-conductive PTFE-filled paste that exhibits low resin bleed and has very fast cure capability. Enhanced reliability of the material is ensured even on a wide variety of surfaces, including solder resist, bare silicon and multiple die passivations, which gives packaging specialists amazing process flexibility.
In addition to all of these benefits, Hysol QMI536NB is also lead-free compatible, showing no reliability issues or material deterioration even when processed in higher temperature lead-free environments.
For more information, log onto www.electronics.henkel.com