Dage wins Advanced Packaging Award for 4000HS high-speed bondtester
Jul 18, 2006
Dage Precision Industries is pleased to announce that it has been awarded the coveted Advanced Packaging Award in the Test Equipment and Services Category for its innovative 4000HS High-Speed Bondtester.
Advanced Packaging magazine's Publisher David Barach presented the award to Alan King, Sales Manager, and Bob Sykes, Engineering Manager, during a Wednesday, July 12, 2006 ceremony that took place at Semicon West in San Francisco, California.
The Dage 4000HS High-Speed Bondtester is the result of considerable research as part of a US consortium and addresses the need to detect brittle fracture failures in the ball-to-pad interconnection of lead-free BGA and CSP semiconductor devices. The capabilities of the latest generation of the 4000HS have been enhanced with digital transducer signal processing, force versus displacement (FvD) curves, and fractional energy calculation.
Built on Dage's globally accepted superior bond test methodology and ease of use, the newly enhanced 4000HS 3G High-Speed Bondtester continues to illustrate that Dage is leading the way in advanced bondtesting solutions.
Celebrating excellence in semiconductor packaging, the Advanced Packaging Awards are presented to the finest examples of creative advancement in semiconductor technology.