Heat Sinks cool BGAs in low air flow conditions
Jul 20, 2006
Advanced Thermal Solutions, Inc. (ATS) has introduced a low profile, high performance heat sink designed for cooling hot BGA components in low airflow velocity conditions. The EX2 heat sink is only 9 mm in height, which allows its use inside enclosures where space is limited. Its case-to-ambient thermal resistance is 1.8Â°C/W within an air velocity of 600 ft/min.
EX2 heat sinks weight just 16 grams and can be securely attached to a component with double-sided, thermally conductive adhesive tape. With no mechanical hardware needed, weight and assembly time are reduced and valuable board space is conserved.
Prices for EX2 heat sinks start at less than $8.00 each in volume orders. More information on these sinks can be found on the Advanced Thermal Solutions web site, www.qats.com, or by calling 1-781-769-2800.