Sanmina-SCI develops OPTI-VIA™

Sanmina-SCI Corporation (Nasdaq: SANM) announced its "Optimal High Speed Printed Circuit Board (PCB) Solutions" seminar is taking place in Ottawa, Canada. This marks the third in Sanmina-SCI's series of Excellence in Technology seminars."Our team thrives on getting together with our customers in a learning environment, showcasing the latest technologies, and giving them the opportunity to get under the hood and see how these technologies will make PCBs work better," said Randy Furr, President and Chief Operating Officer of Sanmina-SCI. "The seminars help our customers get the information they need to optimize their products' performance, solve their technological challenges, and reduce their costs on future product rollouts or revisions."Today's seminar's focus is high-speed system design and fabrication. Key topics include: Design for Optimum Performance, Layout Strategy, High Speed Signal Integrity, Breaking 10 Gpbs with Copper, PWB Materials, Buried Passives, Lead-Free Fabs, HDI & Via Fill Applications, and the latest developments in Electro-Optics. The keynote speaker is respected electronics industry analyst Walt Custer, President and Chief Operating Officer of Custer Consulting. He will discuss the "Business Outlook for the Global Electronics Industry.""Our seminar program is second to none in terms of the technology and solutions we bring to our Customer," said George Dudnikov, Jr., Senior Vice President, Chief Technology Officer of the Sanmina-SCI PCB Division. "These seminars allow us to work directly with our customers to foster a closer working relationship and a shared understanding of the technological issues we face. This mutual understanding and teamwork helps us to match and adjust our capabilities and technology roadmaps to better meet our customers' needs."More than 250 professionals, representing the telecom, military, high-end computing, and medical industries, registered for today's seminar.Source: PCBnewsline