Tamura introduces FLIP Solder Bath
Jun 19, 2006
Tamura H.A. Machinery Inc., a global company that develops and supplies technology-driven lead-free soldering equipment solutions, has introduced FLIP Solder Bath.
FLIP Solder Bath for lead-free reflow soldering solutions features Linear Induction Pumping Technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming's left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two Induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in selective soldering systems, the FLIP is one of a kind.
Additionally, the FLIP Solder Bath features numerous advantages over other solder bath systems, including less solder used and less solder dross. This results in less waste to eliminate making this device not only environmentally efficient but also a significant time saver. It also features a quieter and more stable solder wave than impeller motor types. Because of this, the product is safer for the operator to use. Acid oxidization around the motor spindle is eliminated and a quicker response results.
For more information visit the company's Web site at www.tamura-ha.com.