Milara to premier AWPb 300 wafer process module system at SEMICON West 2006
Jun 23, 2006
Milara Inc., a vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it will introduce AWPb 300 automatic wafer processing module with reflow oven and washer system in booth 9611 on Level 3 of the West Hall at the upcoming SEMICON WEST 2006 trade show and exhibition, scheduled to take place July 10 to 14, 2006, at the Moscone Center in San Francisco.
Milara takes its combined system technology practice one step further with the development of the extremely innovative AWPb 300 Wafer Processing system. The system is capable of handling 150, 200 and 300 mm wafers with either a dual or single FOUP option or cassette load ports.
A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage. Post-print, wafers are transferred to the reflow oven, with the wafer washer ending in the vacant FOUP.
The system uses an SLC 304 vapor phase reflow oven from IBL of Germany and a Sikama Falcon series wafer washer to eliminate post-reflow contaminants. The entire system is capable of processing 30 wafers per hour with future designs to reach up to 40.
Due to the unique design of the AWPb's equipment front-end module, other batch type reflow ovens and cleaners can be integrated at a customer's request.