Concoat to demonstrate thermal profiling software at Nepcon

Concoat has announced that its new SoldaPro Wizard is being demonstrated during the Nepcon show as part of the Smart Group Lead-Free Hands-On Experience.The latest version of the company's thermal profiling software (formerly available from Multicore Solders as SoldaPro Oracle) claims to make determining optimum reflow profiles and corresponding oven settings easier than ever. Simply attach the thermocouple probes of a Concoat Systems SoldaPro thermal profiler (or data logger) to an assembly, run it through an oven, and SoldaPro Wizard will reveal the exact zone settings for the optimum profile of that PCB and its components, without any form of guesswork.All SoldaPro Wizard needs is two or three initial profile runs for either a new oven, or an existing oven whose thermal characteristics have suddenly changed (for instance due to repair maintenance or thorough internal cleaning). It will by then have an intimate knowledge of precisely how the oven behaves and further runs will generally yield little or no appreciable difference in prediction accuracy.Another major benefit of SoldaPro Wizard is that its predicted settings will also immediately identify and compensate for faulty reflow characteristics. This is because its forecasting is based on continuous learning and monitoring of the actual thermal characteristics of an oven. Source: PCBnewsline