Oregon SMTA's Supplier EXPO & Symposium to focus on lead-Free reliability
May 04, 2006
The Oregon Chapter of the SMTA has announced that its Supplier EXPO and Symposium will be held on May 17, 2006, at Tektronix in Beaverton Oregon.
The conference will provide electronics assembly companies, and their customers and suppliers with insights into and solutions to the challenges of ensuring reliability in lead-free solder joints. As lead-free process technology becomes more commonplace the issue of solder joint reliability is increasing more important. The speakers will help manufacturers understand the immediate implications for their businesses.
Papers will be presented by three national recognized experts on lead-free reliability:
-- "Review of the Reliability of Pb-free Interconnections" - Paul Vianco, Sandia National Laboratories
-- "JCAA/JG-PP Lead-Free Solder Project: Vibration Test" - Tom Woodrow, Boeing
-- "Planar Microvoids in BGA Solder Joints" - Raiyo F. Aspandiar, Intel Corporation
In addition, surface mount industry suppliers will be on hand to talk about the latest equipment and products.