New adhesive film from TechFilm Services
May 08, 2006
TechFilm Services, Inc. has introduced T2781 a new thermally conductive electrically insulating high strength adhesive film that provides outstanding thermal performance coupled with excellent adhesion gold, copper and aluminum.
When tested to the ASTM E1461 standard TechFilm's new T2781 provided a thermal conductivity value 2.63 W/M-K. Adhesion to Copper and Aluminum have is in excess of 2500 PSI and gold values are in excess of 1200 PSI. T2781 will cure as quickly as 15 minutes at 165°C or for heat sensitive applications can cure as low as 100°C for 180 minutes.
Typical applications for T2781 include power semiconductor and hybrid circuit substrates to heat sinks and for general bonding where excellent thermal conductivity is desired. Partially cured, 100% solid B-staged adhesives are an alternative to liquid adhesives and solders for highly intricate industrial and electronic bonding applications.
Available in sheet, preform or roll formats as thin as 1.5 mil, this film is ideal for applications where size and bond line thickness of the final part is critical, for example stacked parts and miniaturized components.
For more information on TechFilm T2781, visit the company's Web site at www.techfilm.com.