Dr. Jennie Hwang to conduct Pb-free Reliability seminar in Phoenix on June 20
May 29, 2006
-- What constitutes lead-free reliability
-- How is Pb-free reliability vs. SnPb
-- What tests to perform
-- How to assess reliability
-- What it takes to reach a conclusion
Date: June 20, 2006
Place: Phoenix, AZ
Register early, class Size is limited in order to facilitate discussion and to address attendee's individual comments and questions. As a special bonus valued at $427, each attendee will receive a copy of Dr. Hwang's three textbooks.
This two-session seminar culminates in the principles and practices of what constitutes lead-free reliability, what tests to perform, how to assess reliability, how to draw conclusions. The course is divided into two sessions: the morning session covers all relevant topics on lead-free reliability including 1.Factors; 2.Tests; 3.Integrated test results & interpretation; 4. Fundamentals; 5. Final assessment. The key factors affecting the Pb-free solder joint reliability as well as the components and assembly will be summarized. The question on "how many and which tests should be performed" will be rationalized. The validity of selected test parameters and test results will be outlined. The afternoon session discusses the prevalent phenomena, the likely causes and why they are related to reliability and how to mitigate their probability of occurrence, such as tin whisker, BGA black-pad failure, solder joint surface crack, solder joint voids, BGA solder ball drop issue and high process temperature effects. The underlying distinction between Pb-free and SnPb in relation to reliability will be discussed. Relevant industry standards will also be outlined. Ultimately the combined topics address the question of "How to Assess Pb-free Reliability?" and "What are the crucial criteria to be considered?"
For details/registration: E-mail: email@example.com, Tel: 888-837-9959