SMT Nuremberg - product preview I

SMT is less than two weeks away - here are some of the products that will be in the spotlight at this year's event.

If you would like your product to be previewed please email to editors@emsnow.com

Alternative SMT - Booth 7-233

AlternativeSMT has developed an innovative solution to unnecessary downtime in pick and place machine operation. AlternativeSMT's new Feedermaster now allows manufacturers to assess the performance of the feeders, which makes diagnostics easier if there are process problems and, more importantly, reduces feeder related defects and increases machine utilisation.

FeederMaster is a multi-platform feeder test jig that can be adapted to test a large range of manufacturers' feeders including Fuji, Phillip, Sanyo and, most recently, Siemens. The jig is designed to functionally test feeders by simulating the production environment. This makes it possible to identify and remedy any faults on feeders before they reach production, therefore reducing lost production time due to faulty feeders.

The FeederMaster, which comes complete with a multi-lingual software system, allows operators to control feeders from an on-screen user interface. The multi-lingual menu driven software system gives users access to larger range of operating modes for testing and calibrating feeders.
 
Llew Simmonds, Head of Engineering, said: "This new Test Jig is currently being trialled by a number of the large sub-contractors and once again demonstrates AlternativeSMT's commitment to providing customers with feeders that function as if they were new."

BP Microsystems - Hall 9 Stand 532

BP Microsystems will highlight the Helix, the latest addition to its automated device programmer family.

Also on display will be BP Micro's new ISP-PRO socket module and its latest manual programming systems.

The Helix, introduced in February as a desktop automated system, comes standard with two precision-designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7th Generation programming sites with FX4(TM) socket module capability. FX4(TM) socket module technology allows for programming up to four devices simultaneously per site. The Helix system is designed to handle a wide range of packages including but not limited to MSOP, SOIC, PLCC, SSOP and TSSOP. A tray only version will be available at a later date. 

BP Micro will also exhibit its new ISP-PRO socket module, which was designed to provide in-circuit programming solutions. BP Micro's manual programmers can be connected to the board via a cable interface using the robust and production-ready ISP-PRO socket module.

Also on display will be BP Micro's latest manual device programmers, which now feature high-speed USB 2.0 standard bus for improved communication speed.

For more information on BP Micro's latest product line, visit www.bpmicro.com.

DEK - Booth 7-205

The DEK booth will demonstrate a range of leading-edge solutions designed to boost productivity and performance in the modern manufacturing environment. On-stand exhibits will include DEK's Europa, Horizon 01i and 03i high accuracy mass imaging platforms in conjunction with a range of process enabling technologies.

The DEK booth will host a demonstration of Europa with Rapid Transit Conveyor, a combination capable of reducing core cycle time to just four seconds. Delivering unprecedented speed regardless of other process variables, RTC is a new high speed board transport option developed to improve operator control for optimised print productivity. DEK's SMT Germany offering will also feature HawkEye(TM), an automatic high speed print verification technology. Analysing streamed 2D board images in real time to generate pass/fail indications at the line beat rate, HawkEye delivers instant isolation of faulty boards.

Taking place one month prior to the enforcement of the RoHS directive deadline, much of DEK's on-stand activity will relate to its comprehensive lead-free portfolio. The DEK Lead-Free display will feature a range of high quality consumables, ProFlow®®® and VectorGuard(TM). VectorGuard Gold and Silver electro-formed and laser-cut nickel stencil technologies are specifically designed to accommodate changing paste properties through enhanced aperture release and paste volume repeatability.  Meanwhile, the demonstration of ProFlow enclosed print head technology, will highlight its ability to extend the high accuracy mass imaging process window for improved throughput, yield and efficiency.

Elektrobit - Booth 414

Elektrobit announces that it will display the Odd Shape Cell J504-05 in booth 414 at the upcoming SMT/Hybrid/Packaging 2006 exhibition and conference.

J504-05 is an automatic component placement cell for odd shaped components that is based on the basic idea of high productivity and quality of process. The cell features reliability with proven mechanics and robotics together with Elektrobit's years of software development and process know-how experience including feeding, pre-forming and gripping systems to achieve a reliable odd shape component process.

The cell accepts a wide variety of component feeders and grippers, and features an automatic gripper change system to meet the requirements of each inserted component type. Additionally, the cell accommodates active or passive clinching, and provides users with lead insertion verification, as well as a flexible platform for future requirements. It is easy to set up with graphical user interface and offers network capability.

The cell provides users with numerous standard features including a feeding capacity of up to 15 different component codes, flexible and accurate gripping systems, four axis servo-driven active clinching, and a programmable active clinching head.

In addition, Elektrobit will exhibit its laser marker, an in-line laser marker for marking various materials automatically. Capable of marking barcodes, 2-D codes, text and graphics, the system is easy to program with user-friendly PC software.

Additionally, the marker provides precise PCB positioning with pneumatic cylinders. Top quality marking results are accomplished in a compact footprint.

ESSEMTEC - Hall 7 Stand 203

ESSEMTEC AG will highlight CSM7100V, a highly flexible pick-and-place system with intelligent feeders and vision for high-mix/low-volume production.

A large feeder capacity, intelligent feeders and easy-to-use operation software are key features for a highly flexible production machine. CSM7100V's standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Also, tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.

CSM7100V with vision pick-and-place fulfils the requirements of high-mix/low-volume SMT production. It offers a wide application range as well as outstanding performance. Benefits of the system include a feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4,000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter. Additionally, the system can place components from 0402 to 33 x 33 mm QFPs.

Machine operation software LIGHTPLACER is a key factor in the system's flexibility. The powerful Windows-based software features a fully graphical man-machine interface, making operation and programming easy.

ESSEMTEC AG will also highlight WS330, a professional wave soldering machine for the production of small and midsize batches.

WS330 is a compact, professional wave soldering machine for small and midsize volumes in standard and lead-free technologies. The solder width of up to 330 mm (13") and the universal pallet transport system allow users to work with a large variety of PCBs. The system also is equipped with a dual-wave technology, allowing both THT and SMT components to be soldered.

WS330 offers users multiple benefits and features including inert gas (N2) solder wave, proven composite coating for lead-free applications, easily programmable, compact footprint, infinite variable transport speed, and more. Additionally, the system is equipped with a universal palette transportation system based on an antistatic belt. Ergonomic loading/unloading heights ease the system's operation.

Also, ESSEMTEC AG will display MPL3100 Microplacer, in Paggen Werkzeugtechnik GmbH's booth, which is located in hall 7, stand 301.

The Microplacer MPL3100 from ESSEMTEC can accurately place today's state-of-the-art component types, such as BGA, CSP and ultra-fine-pitch parts. It enhances assembly lines with without that capability, as well as prototyping or low-volume production sites.

Despite being manual, the placement process is efficient and as precise as possible. An integrated vision system provides an image of the component's bottom as well as of the PCB surface. A two-color, adjustable illumination allows users to achieve the best possible contrast for any surface type. For large components, an additional split vision system can be inserted that significantly enlarges the two opposite corners on the monitor.

The high precision mechanic is based on the experience of automatic SMD placement machines that are available from ESSEMTEC. It allows all difficult component types to be precisely and efficiently mounted.

Henkel - Hall 9, Stand 349

Developed specifically for stacked die applications that require extremely low stress and robust mechanical properties, the electronics group of Henkel has introduced Hysol®®® QMI536NB. 

Unlike other die attach materials used for stacked die manufacture, Hysol QMI536NB can be used on all levels of a stacked die, enabling packaging specialists to qualify a single material.

The non-conductive PTFE-filled paste exhibits low resin bleed and has very fast cure capability.  Enhanced reliability of the material is ensured even on a wide variety of surfaces, including solder resist, bare silicon and multiple die passivations.  The higher processing temperatures of lead-free manufacturing do not adversely affect Hysol QMI536NB, which has shown high resistance to delamination and popcorning even after multiple exposures to 260C+ reflow temperatures.

Kester - Hall 8 Stand 315

Kester has announced that it will highlight its Lead-Free products.

Kester will be featuring numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Among products being featured are EnviroMark 907 and 918 lead-free no-clean pastes, low-cost Ultrapure K100 lead-free bar solder alloy, 979 and 979VT VOC-free organic no-clean flux formulations, 959T no-clean flux, 275 no-clean wire and TSF-6592 tacky soldering fluxes, along with Kester's technical services to help manufacturers assemble lead-free.

As always, Kester's global lead-free team of technical engineers will be present to answer all lead-free questions that companies may have about lead-free assembly. Be sure to stop by Hall 8 Stand 315 for more information.

Kester's Web site may be found at www.kester.com.

Novatec - Hall 8 Stand 207

Novatec, a key research laboratory that develops new technologies for the electronics assembly industry, announces that it will display an innovative new assembly tool for board support - VacuNest Shape Memory Tooling.

VacuNest combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board - on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will be held for weeks/days/months until the vacuum is released, whereupon the modules return to their original form, awaiting a new set up for the next version of board.

VacuNest offers users numerous advantages, including no risk damage to a component due to the pin/printing pressure, the support forces are evenly spread over the entire board, the tooling provides firm and precise support, ease of use, no dedicated tooling and short payback period, and the shape tool can be simply reset when a board version changes.

Additionally, this flexible tooling features many cost benefits. It eliminates the cost of a custom tooling plate as well as pin tooling by providing a single, user-friendly solution. VacuNest has the capability to handle high-density boards with ease and requires little to no lead-time.

Many VacuNest systems are already in use throughout the world.

For more information, e-mail novatec@novatec-eap.com.

Siemens - Hall 7, Stand 506

Siemens Electronics Assembly Systems will present two new, innovative SIPLACE platforms: the new digital SMT placement machines of the SIPLACE D-Series and the new SIPLACE Die Bonding platform SIPLACE A-Series.

The new SIPLACE D-Series was designed as a direct response from the industry to offer a highly innovative platform with innovative values. The SMT placement machines of the SIPLACE D-Series are based on a standardized platform, which includes the digital vision system from the SIPLACE premium line, the X-Series, as well as the latest SIPLACE software. The new SMT platform for standard and high performance applications is available in four versions as SIPLACE D1, D2, D3 and D4 with the corresponding number of gantries.

Depending on their configuration, these machines meet the demands of standard or high-performance applications. The combination of innovative technology coupled with innovative value is the perfect solution to meet the needs of today's global electronics manufacturers looking for the best value for their investment.   As always, SIPLACE's philosophy of consistency ensures that the new machines are compatible with existing production lines.

Within three months of acquiring the F&K Delvotec Die Bonder activities Siemens EA is already presenting the first Siemens Die Bonding System. The new platform will be the choice for electronics manufacturers who want to produce Die Attach as well as Flip Chip applications flexibly, fast and accurately. The robust SIPLACE A-Series handles all epoxy and pick&place placement processes with very high precision. The SIPLACE A-series is available in two versions, the SIPLACE A1 with one gantry and the SIPLACE A2, with two gantries.

For further information visit www.siplace.com

Speedprint - Hall 7 Stand 116

Speedprint Technology Ltd. will highlight the SPRINTavi Automatic Inline Stencil Printer in ANS-Answer Elektronik's booth.

The SPRINTavi Automatic Inline Stencil Printer provides exceptional functionality and numerous standard features that maximize both speed and throughput rates. Designed for fine-pitch applications, this flexible printer combines high build quality and many advanced features generally only found on more expensive machines, providing significant cost benefits to users.

The precision-machined print head features closed-loop squeegee control and fully programmable print parameters. The patented "look down - look down" camera alignment system not only provides 6 sigma alignment repeatability but also gives the printer the facility to inspect the on-stencil paste and automatically dispense new paste in the appropriate position.

The innovative camera alignment system ensures 6 sigma repeatability as well as numerous additional benefits, such as a full range of options, an advanced control system that contributes to low cost of ownership, and an over-stencil camera that provides in-process auto paste inspect.

A wide range of options is available for the Sprint. These include a fully programmable paste dispenser, powered rail PCB width adjust, SPC data logging software, VacuNest tooling, laser tooling with Gerber import utility, 2D+ paste inspection with bridge detection and Gerber import utility, 2-D solder paste inspection, squeegee assemblies (per pair: sizes 170 to 320 mm and 370 to 490 mm), Siemens Upline interface, and Siemens Downline interface.

Speedprint Technology Ltd. Also announces it will exhibit the SP200avi inline stencil printer. SP200avi is a revolutionary addition to the Speedprint range of stencil printers. Designed for medium and high throughput, high-mix applications, the 23" inline stencil printer delivers outstanding performance and value.

The system uses a unique, patent protected "look down, look down" approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure accurate and repeatable precision alignment using fiducial marks or PCB/stencil features. This innovative vision system facilitates a unique "paste on stencil" inspection feature that enables users to determine if there is adequate paste on the stencil before running the print cycle.

Ease of maintenance and low cost of ownership are key characteristics of the SP200avi.