Rogers Corp to introduce RO4450B-dx Bondply at IEEE MTT- S
Apr 11, 2006
Rogers Corporation will be introducing its new RO4450B™-dx Bondply, a high fill/flow version of the industry standard RO4450B™ High Frequency Circuit Material, at this year's International Microwave Symposium, taking place from June 13-15, 2006, in San Francisco, California. Rogers will be exhibiting on stand number 1441. RO4450B circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards. These bondplys are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes. The new RO4450B-dx is a high fill/flow version of the RO4450B bondply. It is designed to fill those high-density designs while still offering thin dielectric spacing. RO4403™, RO4450B™, and RO4450B™-dx prepregs are based upon the RO4000 series core materials and are compatible in multilayer constructions with either RO4003C or RO4350B laminates. As with RO4000 laminates, RO4400 prepregs are compatible with the majority of standard FR4 processing practices. Rogers will also be featuring the following materials at the show: R/flex® 3000 Family of Liquid Crystalline Polymer (LCP)-based Circuit Materials includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate. RT/duroid® 6202 Material - An addition to Rogers' traditional microwave laminates, this material provides the key feature of improved dimensional stability while supporting the highest performance requirements for the most demanding applications for frequencies of 3 GHz to over 90 GHz. Its other key properties include superior electrical characteristics and highly predictable performance.
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